- Attachment Method:
-
- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Selected conditions:
Discover 17 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Advanced Thermal Solutions Inc. |
321
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 33MM X 33MM X 19.5MM
|
Square, Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | 4.10°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
302
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 33MM X 33MM X 19.5MM
|
Square, Pin Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | 4.50°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
855
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 33MM X 33MM X 24.5MM
|
Square, Pin Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 3.40°C/W @ 200 LFM | - | ||||
ASSMANN WSW Components |
317
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
Rectangular, Fins | 0.748" (19.00mm) | Press Fit | 24-DIP | 0.189" (4.80mm) | - | 48.00°C/W | ||||
Advanced Thermal Solutions Inc. |
89
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 33MM X 33MM X 9.5MM
|
Square, Pin Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | 12.30°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
46
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 33MM X 33MM X 24.5MM
|
Square, Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 3.10°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
93
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 33MM X 33MM X 9.5MM
|
Square, Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | 11.10°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
32
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 33MM X 33MM X 14.5MM
|
Square, Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | 5.80°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
78
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 33MM X 33MM X 14.5MM
|
Square, Pin Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | 6.40°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 33X33X9.5MM W/OUT TIM
|
Square, Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.374" (9.50mm) | 11.10°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 33X33X9.5MM W/OUT TIM
|
Square, Pin Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.374" (9.50mm) | 12.30°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 33X33X14.5MM W/OUT TIM
|
Square, Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.571" (14.50mm) | 5.80°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 33X33X14.5MM W/OUT TIM
|
Square, Pin Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.571" (14.50mm) | 6.40°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 33X33X19.5MM W/OUT TIM
|
Square, Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.768" (19.50mm) | 4.10°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 33X33X19.5MM W/OUT TIM
|
Square, Pin Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.768" (19.50mm) | 4.50°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 33X33X24.5MM W/OUT TIM
|
Square, Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.964" (24.50mm) | 3.10°C/W @ 200 LFM | - | ||||
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 33X33X24.5MM W/OUT TIM
|
Square, Pin Fins | 1.299" (32.99mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.964" (24.50mm) | 3.40°C/W @ 200 LFM | - |