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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Rectangular, Fins | 0.700" (17.78mm) | Bolt On | TO-220 | 0.375" (9.52mm) | 1.0W @ 20°C | 6.00°C/W @ 600 LFM | 20.00°C/W | ||
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Advanced Thermal Solutions Inc. |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK 12-SIP W/TAB BLACK
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Board Level, Vertical | Rectangular | 1.700" (43.18mm) | Bolt On and PC Pin | 12-SIP | 0.400" (10.16mm) | - | 4.50°C/W @ 200 LFM | 10.00°C/W |
