- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
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Wakefield-Vette |
17,584
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/DBL TAPE
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Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 25.00°C/W @ 200 LFM | ||
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Wakefield-Vette |
5,813
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/ADH BLK
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Thermal Tape, Adhesive (Included) | 0.450" (11.43mm) | 15.00°C/W @ 200 LFM | ||
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Wakefield-Vette |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/OUT ADH
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Thermal Tape, Adhesive (Not Included) | 0.450" (11.43mm) | 15.00°C/W @ 200 LFM | ||
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Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ
|
Thermal Tape, Adhesive (Included) | 0.450" (11.43mm) | 15.00°C/W @ 200 LFM | ||
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|
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Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/DBL TAPE
|
Thermal Tape, Adhesive (Included) | 0.250" (6.35mm) | 25.00°C/W @ 200 LFM | ||
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|
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Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQUARE W/TAPE
|
Thermal Tape, Adhesive (Included) | 0.350" (8.89mm) | 15.00°C/W @ 400 LFM |
