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Discover 13 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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ASSMANN WSW Components |
25,551
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM CPU
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Aluminum | Square, Pin Fins | 0.393" (10.00mm) | 0.393" (10.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.275" (7.00mm) | - | - | 31.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
2,297
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 COPPER
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Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D2Pak) | 0.402" (10.21mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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Advanced Thermal Solutions Inc. |
2,750
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 COPPER
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Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D2Pak) | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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Advanced Thermal Solutions Inc. |
2,833
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 COPPER
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Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D2Pak) | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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Advanced Thermal Solutions Inc. |
2,833
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-263 COPPER
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Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D2Pak) | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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Advanced Thermal Solutions Inc. |
938
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-252 D-PAK COPPER
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Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.842" (21.40mm) | TO-252 (DPAK) | 0.400" (10.16mm) | - | 21.00°C/W @ 200 LFM | 28.00°C/W | Tin | |||
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Wakefield-Vette |
69
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUSION 15.25"
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Aluminum | Rectangular, Fins | 15.250" (387.35mm) | 3.980" (101.00mm) | Power Modules | 1.880" (47.75mm) | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
10
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3 days |
-
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MOQ: 1 MPQ: 1
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78345 EXTRUSION 1.54X2.68"X4.1
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Aluminum | Rectangular, Pin Fins | 49.500" (1257.3mm) | 2.677" (68.00mm) | - | 1.535" (39.00mm) | - | 1.00°C/W @ 400 LFM | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
6
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3 days |
-
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MOQ: 1 MPQ: 1
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78065 EXTRUSION 1.1X0.76"X4.1
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Aluminum | Rectangular, Pin Fins | 49.500" (1257.3mm) | 0.764" (19.40mm) | - | 0.847" (21.50mm) | - | 3.80°C/W @ 200 LFM | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
10
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3 days |
-
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MOQ: 1 MPQ: 1
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78030 EXTRUSION 2.36X2.9"X4.1
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Aluminum | Rectangular, Pin Fins | 49.500" (1257.3mm) | 2.895" (73.54mm) | - | 2.362" (60.00mm) | - | 0.80°C/W @ 300 LFM | - | - | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 3.6W ALUMINUM
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Aluminum | Rectangular, Fins | 0.279" (7.10mm) | 0.787" (20.00mm) | TO-220 | 1.000" (25.40mm) | 3.6W @ 75°C | 7.45°C/W @ 200 LFM | 20.83°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-252, 8 X
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Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPAK) | 0.400" (10.16mm) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | Tin | ||
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CUI Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 14.
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Copper | Rectangular, Fins | 0.590" (14.99mm) | 1.020" (25.91mm) | TO-263 (D2Pak) | 0.375" (9.52mm) | 2.1W @ 75°C | 8.15°C/W @ 200 LFM | 35.71°C/W | Tin |
