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Discover 85 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Wakefield-Vette |
113
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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510 | Aluminum | Rectangular, Fins | 6.000" (152.40mm) | 7.380" (187.45mm) | - | Adhesive | Power Modules | 3.106" (78.89mm) | - | - | 0.38°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
40
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3 days |
-
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MOQ: 1 MPQ: 1
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74765 EXTRUSION 1.025X4.235"X5
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- | Aluminum | Rectangular, Fins | 60.000" (1524.00mm) | 4.235" (107.57mm) | - | Adhesive | - | 1.025" (26.03mm) | - | 0.50°C/W @ 500 LFM | - | ||
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Wakefield-Vette |
39
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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510 | Aluminum | Rectangular, Fins | 14.000" (355.60mm) | 7.380" (187.45mm) | - | Adhesive | Power Modules | 3.136" (79.65mm) | - | - | 0.21°C/W | ||
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Wakefield-Vette |
30
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3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR PWR MOD/IGBT/RELAY
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510 | Aluminum | Rectangular, Fins | 14.000" (355.60mm) | 7.380" (187.45mm) | - | Adhesive | Power Modules | 3.106" (78.89mm) | - | - | 0.21°C/W | ||
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Wakefield-Vette |
4,209
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 100PQFP COMPOSITE
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Deltem | Composite | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | ||
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Wakefield-Vette |
900
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 128PQFP COMPOSITE
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Deltem | Composite | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | - | Thermal Tape, Adhesive (Not Included) | BGA | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | ||
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Sunon Fans |
367
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 35X35X20MM W/ADH
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- | Aluminum | Square, Pin Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | - | Thermal Tape, Adhesive (Included) | - | 0.790" (20.00mm) | - | - | - | ||
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Wakefield-Vette |
158
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUSION 12.32"
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- | Aluminum | Rectangular, Fins | 12.320" (312.93mm) | 3.420" (86.87mm) | - | Adhesive | Power Modules | 1.630" (41.40mm) | - | 30.00°C/W @ 200 LFM | 0.95°C/W | ||
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Wakefield-Vette |
35
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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512 | Aluminum | Rectangular, Fins | 9.000" (228.60mm) | 7.200" (182.88mm) | - | Adhesive | Power Modules | 2.350" (59.69mm) | - | - | 0.56°C/W | ||
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Wakefield-Vette |
31
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3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR PWR MOD/IGBT/RELAY
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510 | Aluminum | Rectangular, Fins | 9.000" (228.60mm) | 7.380" (187.45mm) | - | Adhesive | Power Modules | 3.136" (79.65mm) | - | - | 0.29°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
33
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3 days |
-
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MOQ: 1 MPQ: 1
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63730 EXTRUSION 2.25X2.996"X4
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- | Aluminum | Rectangular, Pin Fins | 48.000" (1219.20mm) | 3.000" (76.20mm) | - | Adhesive | - | 2.250" (57.15mm) | - | 1.00°C/W @ 200 LFM | - | ||
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Wakefield-Vette |
29
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3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR PWR MOD/IGBT/RELAY
|
510 | Aluminum | Rectangular, Fins | 9.000" (228.60mm) | 7.380" (187.45mm) | - | Adhesive | Power Modules | 3.106" (78.89mm) | - | - | 0.29°C/W | ||
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Wakefield-Vette |
26
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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510 | Aluminum | Rectangular, Fins | 12.000" (304.80mm) | 7.380" (187.45mm) | - | Adhesive | Power Modules | 3.106" (78.89mm) | - | - | 0.24°C/W | ||
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Adafruit Industries LLC |
1,256
|
3 days |
-
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MOQ: 1 MPQ: 1
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ALUMINIUM HEATSINK FOR RASPBERRY
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- | Aluminum | Square, Fins | 0.600" (15.24mm) | 0.600" (15.24mm) | - | Thermal Tape, Adhesive (Included) | Raspberry Pi | 0.600" (15.24mm) | - | - | - | ||
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Seeed Technology Co., Ltd |
636
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK KIT FOR RASPBERRY PI
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- | Aluminum | Square, Fins | - | - | - | Adhesive | - | - | - | - | - | |||
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Sunon Fans |
627
|
3 days |
-
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MOQ: 1 MPQ: 1
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PUSHPIN HEATSINK 31X31X10MM
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- | Aluminum | Square, Fins | 1.236" (31.40mm) | 1.236" (31.40mm) | - | Push Pin | - | 0.394" (10.00mm) | - | - | - | ||
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Trenz Electronic GmbH |
108
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TE0712 SPRINGLOADED
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TE0712 | - | Rectangular, Fins | - | - | - | Bolt On | TE0712 | - | - | - | - | ||
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Wakefield-Vette |
47
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR PWR MOD/IGBT/RELAY
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512 | Aluminum | Rectangular, Fins | 12.000" (304.80mm) | 7.200" (182.88mm) | - | Adhesive | Power Modules | 2.410" (61.21mm) | - | - | 0.45°C/W | ||
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Advanced Thermal Solutions Inc. |
91
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK AL6063 254X100X10MM
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- | Aluminum | Rectangular, Fins | 10.000" (254.00mm) | 3.937" (100.00mm) | - | Adhesive | - | 0.394" (10.00mm) | - | - | - | |||
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Trenz Electronic GmbH |
32
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TE0720 SPRINGLOADED
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TE0720 | - | Rectangular, Fins | - | - | - | Bolt On | TE0720 | - | - | - | - |
