- Manufacturer：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
9,699
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3 days |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D-PAK
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- | 0.315" (8.00mm) | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
4,750
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
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- | 0.315" (8.00mm) | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
4,764
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
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- | 0.315" (8.00mm) | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | ||
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CUI Inc. |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-252, 8 X
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- | 0.315" (8.00mm) | - | TO-252 (DPAK) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | ||
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Wakefield-Vette |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM BLACK SMD
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218 | 0.320" (8.13mm) | SMD Pad | SMD | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | 31.00°C/W | ||
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Comair Rotron |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 22.9X8X10.2MM
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- | 0.315" (8.00mm) | SMD Pad | TO-252 (DPAK) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - |
