- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Width | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Aavid, Thermal Division of Boyd Corporation |
4,117
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 TAB TIN
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1.180" (29.97mm) | 1.000" (25.40mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 13.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
1,584
|
3 days |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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2.000" (50.80mm) | 1.380" (35.05mm) | 2.0W @ 30°C | 5.00°C/W @ 200 LFM | 9.40°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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1.180" (29.97mm) | 1.000" (25.40mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | 13.60°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
1.180" (29.97mm) | 1.000" (25.40mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | 13.60°C/W |
