- Manufacturer：
-
- Series：
-
- Material：
-
- Usage：
-
- Backing，Carrier：
-
- Thermal Resistivity：
-
- Thermal Conductivity：
-
- Selected conditions:
Discover 3 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Thickness | Usage | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Thickness | Usage | Outline | Backing，Carrier | Thermal Resistivity | Thermal Conductivity | |
|
|
|
Laird Technologies - Thermal Materials |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TGON 805,A0 TO-3 6 HOLE 0.006"
|
Tgon 805 | Graphite | 0.0050" (0.127mm) | TO-3 | 39.62mm x 26.67mm | - | 0.07°C/W | 5.0 W/m-K | ||
|
|
|
Laird Technologies - Thermal Materials |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
TGON 805,A0 POWER MODULE 0.005"
|
Tgon 805 | Graphite | 0.0050" (0.127mm) | Power Module | 63.50mm x 50.80mm | - | 0.07°C/W | 5.0 W/m-K | ||
|
|
|
Bergquist |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
THERMAL PAD 0.006" K4
|
Sil-Pad K-4 | Silicone Rubber | 0.0060" (0.152mm) | TO-220 | - | Polyimide | 0.48°C/W | 0.9 W/m-K |
