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- Adhesive:
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- Thermal Conductivity:
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Discover 3 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Color | Thickness | Usage | Adhesive | Thermal Conductivity | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Color | Thickness | Usage | Adhesive | Thermal Conductivity | ||
Laird Technologies - Thermal Materials |
7,455
|
3 days |
-
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MOQ: 1 MPQ: 1
|
TPCM5810 16X16MM W/TABS VERO18
|
Tpcm 580 | Phase Change Compound | Gray | 0.0100" (0.254mm) | - | Tacky - Both Sides | 3.8 W/m-K | ||||
t-Global Technology |
31,338
|
3 days |
-
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MOQ: 1 MPQ: 1
|
THERMAL PAD TG6050 16X16X1MM
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TG6050 | Silicone Elastomer | Red | 0.0400" (1.016mm) | - | Tacky - Both Sides | 6.0 W/m-K | ||||
Bergquist |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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THERMAL PAD CPU .63"X.63"
|
CPU Pad | - | Tan | 0.0050" (0.127mm) | CPU | - | 0.6 W/m-K |