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Discover 37 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Main Purpose | Input | Output | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Main Purpose | Input | Output | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | |
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Diodes Incorporated |
Inquiry
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- |
-
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MOQ: 296 MPQ: 1
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IC CLOCK GENERATOR 20-TSSOP
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Tube | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | PCI Express (PCIe) | HCSL | HCSL | 0.08611111111111112 | Yes/Yes | 200MHz | ||
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IDT，Integrated Device Technology Inc |
Inquiry
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- |
-
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MOQ: 144 MPQ: 1
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IC CLK BUFFER 1:4 HCSL 20-TSSOP
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Tube | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | PCI Express (PCIe) | HCSL，LVDS | HCSL，LVDS | 0.08611111111111112 | Yes/Yes | 200MHz | ||
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IDT，Integrated Device Technology Inc |
Inquiry
|
- |
-
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MOQ: 2500 MPQ: 1
|
IC CLK BUFFER 1:4 HCSL 20-TSSOP
|
Tape & Reel (TR) | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | PCI Express (PCIe) | HCSL，LVDS | HCSL，LVDS | 0.08611111111111112 | Yes/Yes | 200MHz | ||
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IDT，Integrated Device Technology Inc |
Inquiry
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- |
-
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MOQ: 2016 MPQ: 1
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IC CLK BUFFER 1:4 HCSL 20-TSSOP
|
Tube | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | PCI Express (PCIe) | HCSL，LVDS | HCSL，LVDS | 0.08611111111111112 | Yes/Yes | 200MHz | ||
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IDT，Integrated Device Technology Inc |
Inquiry
|
- |
-
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MOQ: 2500 MPQ: 1
|
IC CLK BUFFER 1:4 HCSL 20-TSSOP
|
Tape & Reel (TR) | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | PCI Express (PCIe) | HCSL，LVDS | HCSL，LVDS | 0.08611111111111112 | Yes/Yes | 200MHz | ||
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Microsemi Corporation |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
|
IC CLK DATA REC SDH 622MBPS
|
Tape & Reel (TR) | - | 3.135 V ~ 3.465 V | 0°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) Exposed Pad | SONET/SDH，DWDM | LVTTL | LVDS，LVPECL | 0.04305555555555556 | Yes/Yes | 622Mbps | ||
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Microsemi Corporation |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
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IC CLK DATA REC SDH 622MBPS
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Tape & Reel (TR) | - | 3.135 V ~ 3.465 V | -40°C ~ 95°C | 20-TSSOP (0.173"，4.40mm Width) Exposed Pad | SONET/SDH，DWDM | LVTTL | LVDS，LVPECL | 0.04305555555555556 | Yes/Yes | 622Mbps | ||
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IDT，Integrated Device Technology Inc |
2,681
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC BUFFER MUX 2:4 20TSSOP
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Tube | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | PCI Express (PCIe) | HCSL | HCSL，LVDS | 0.08611111111111112 | Yes/Yes | 200MHz | |||
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IDT，Integrated Device Technology Inc |
3,000
|
3 days |
-
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MOQ: 3000 MPQ: 1
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IC FAN/BUFFER DIFF 20TSSOP
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Tape & Reel (TR) | - | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | 150MHz | |||
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IDT，Integrated Device Technology Inc |
3,716
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC FAN/BUFFER DIFF 20TSSOP
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Cut Tape (CT) | - | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | 150MHz | |||
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IDT，Integrated Device Technology Inc |
3,716
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC FAN/BUFFER DIFF 20TSSOP
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- | - | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | 150MHz | |||
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IDT，Integrated Device Technology Inc |
2,085
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:4 HCSL 20-TSSOP
|
Tube | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | PCI Express (PCIe) | HCSL，LVDS | HCSL，LVDS | 0.08611111111111112 | Yes/Yes | 200MHz | |||
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IDT，Integrated Device Technology Inc |
334
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK MUX PCIE 2 TO 4 20TSSOP
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Tube | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | PCI Express (PCIe) | HCSL | HCSL，LVDS | 0.08611111111111112 | Yes/Yes | 200MHz | |||
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IDT，Integrated Device Technology Inc |
305
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK FANOUT/BUFF DIFF 20TSSOP
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Tube | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | 150MHz | |||
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IDT，Integrated Device Technology Inc |
1,032
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC FAN/BUFF DIFF 20TSSOP
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Tube | - | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | 150MHz | |||
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IDT，Integrated Device Technology Inc |
Inquiry
|
- |
-
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MOQ: 3000 MPQ: 1
|
IC CLK FANOUT/BUFF DIFF 20TSSOP
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Tape & Reel (TR) | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | 150MHz | |||
|
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IDT，Integrated Device Technology Inc |
1,917
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC CLK FANOUT/BUFF DIFF 20TSSOP
|
Cut Tape (CT) | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | 150MHz | |||
|
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IDT，Integrated Device Technology Inc |
1,917
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC CLK FANOUT/BUFF DIFF 20TSSOP
|
- | - | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | Intel QPI，PCI Express (PCIe) | HCSL | LP-HCSL | 0.04444444444444445 | Yes/Yes | 150MHz | |||
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Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 500 MPQ: 1
|
IC CLK DATA REC SDH 622MBPS
|
Tape & Reel (TR) | - | 3.135 V ~ 3.465 V | 0°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) Exposed Pad | SONET/SDH，DWDM | LVTTL | LVDS，LVPECL | 0.04305555555555556 | Yes/Yes | 622Mbps | |||
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Microchip Technology |
467
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC CLK DATA REC SDH 622MBPS
|
Cut Tape (CT) | - | 3.135 V ~ 3.465 V | 0°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) Exposed Pad | SONET/SDH，DWDM | LVTTL | LVDS，LVPECL | 0.04305555555555556 | Yes/Yes | 622Mbps |
