- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Main Purpose：
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- Ratio - Input:Output：
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- Frequency - Max：
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- Selected conditions:
Discover 50 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | PLL | Main Purpose | Input | Ratio - Input:Output | Frequency - Max | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | PLL | Main Purpose | Input | Ratio - Input:Output | Frequency - Max | |
|
IDT，Integrated Device Technology Inc |
2,450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFF DIFF 20-VFQFPN
|
Tube | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
3,000
|
3 days |
-
|
MOQ: 3000 MPQ: 1
|
IC FAN/BUFFER DIFF 20TSSOP
|
Tape & Reel (TR) | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
3,716
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFFER DIFF 20TSSOP
|
Cut Tape (CT) | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
3,716
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFFER DIFF 20TSSOP
|
- | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
457
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MUX PCIE 2:1 1.8V 16VFQFPN
|
Tube | 1.7 V ~ 1.9 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) | No | PCI Express (PCIe) | LVDS | 0.08402777777777777 | 200MHz | |||
|
|
IDT，Integrated Device Technology Inc |
444
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFF DIFF 20VQFN
|
Tube | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
1,715
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER 5OUTPUT 1.5V 32MLF
|
Tray | 1.425 V ~ 1.575 V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) | No | PCI Express (PCIe) | HCSL | 0.04513888888888889 | 167MHz | |||
|
|
IDT，Integrated Device Technology Inc |
305
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC CLK FANOUT/BUFF DIFF 20TSSOP
|
Tube | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
1,200
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER 8OUTPUT 1.5V 48MLF
|
Tray | 1.425 V ~ 1.575 V | 0°C ~ 70°C | 48-VFQFN Exposed Pad | 48-VFQFPN (6x6) | Yes | PCI Express (PCIe) | HCSL | 0.04722222222222222 | 167MHz | |||
|
|
IDT，Integrated Device Technology Inc |
225
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER 2OUTPUT 1.5V 24VFQFPN
|
Tray | 1.425 V ~ 1.575 V | 0°C ~ 70°C | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Yes | PCI Express (PCIe) | HCSL | 0.04305555555555556 | 167MHz | |||
|
|
IDT，Integrated Device Technology Inc |
1,032
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFF DIFF 20TSSOP
|
Tube | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
248
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER 6OUTPUT 1.5V 40MLF
|
Tray | 1.425 V ~ 1.575 V | -40°C ~ 85°C | 40-VFQFN Exposed Pad | 40-VFQFPN (5x5) | Yes | PCI Express (PCIe) | HCSL | 0.04583333333333334 | 167MHz | |||
|
|
IDT，Integrated Device Technology Inc |
293
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER 9OUTPUT 1.5V 48MLF
|
Tray | 1.425 V ~ 1.575 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 48-VFQFPN (6x6) | No | PCI Express (PCIe) | HCSL | 0.04791666666666666 | 167MHz | |||
|
|
IDT，Integrated Device Technology Inc |
Inquiry
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC FAN/BUFFER DIFF 20VFQFPN
|
Tape & Reel (TR) | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
2,097
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFFER DIFF 20VFQFPN
|
Cut Tape (CT) | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
2,097
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC FAN/BUFFER DIFF 20VFQFPN
|
- | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
Inquiry
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC CLK FANOUT/BUFF DIFF 20TSSOP
|
Tape & Reel (TR) | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
1,917
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC CLK FANOUT/BUFF DIFF 20TSSOP
|
Cut Tape (CT) | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
1,917
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC CLK FANOUT/BUFF DIFF 20TSSOP
|
- | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173"，4.40mm Width) | 20-TSSOP | No | Intel QPI，PCI Express (PCIe) | HCSL | 0.04444444444444445 | 150MHz | |||
|
|
IDT，Integrated Device Technology Inc |
75
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER 2OUTPUT 1.5V 24VFQFPN
|
Tray | 1.425 V ~ 1.575 V | -40°C ~ 85°C | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Yes | PCI Express (PCIe) | HCSL | 0.04305555555555556 | 167MHz |
