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Discover 28 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Output | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Output | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | |
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IDT，Integrated Device Technology Inc |
Inquiry
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- |
-
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MOQ: 485 MPQ: 1
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IC CLK BUFFER 1:2 156MHZ 8SOIC
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- | 3 V ~ 5.5 V | 0°C ~ 70°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | CMOS | 3-State，CMOS | 0.04305555555555556 | No/No | 156MHz | ||
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IDT，Integrated Device Technology Inc |
Inquiry
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- |
-
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MOQ: 485 MPQ: 1
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IC CLK BUFFER 1:2 156MHZ 8SOIC
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- | 3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | CMOS | 3-State，CMOS | 0.04305555555555556 | No/No | 156MHz | ||
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IDT，Integrated Device Technology Inc |
Inquiry
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- |
-
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MOQ: 96 MPQ: 1
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IC CLK BUFFER 1:4 250MHZ 16TSSOP
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ClockBlocks | 3.15 V ~ 3.5 V | 0°C ~ 70°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | LVHSTL | CMOS | 0.04444444444444445 | Yes/No | 250MHz | ||
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IDT，Integrated Device Technology Inc |
Inquiry
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- |
-
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MOQ: 96 MPQ: 1
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IC CLK BUFFER 1:4 250MHZ 16TSSOP
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ClockBlocks | 3.15 V ~ 3.5 V | 0°C ~ 70°C | 16-TSSOP (0.173"，4.40mm Width) | 16-TSSOP | LVHSTL | CMOS | 0.04444444444444445 | Yes/No | 250MHz | ||
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IDT，Integrated Device Technology Inc |
Inquiry
|
- |
-
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MOQ: 100 MPQ: 1
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IC CLK BUFFER 1:3 2GHZ 16VFQFN
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- | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) | CML，LVDS，LVPECL | LVPECL | 0.04375 | Yes/Yes | 2GHz | ||
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IDT，Integrated Device Technology Inc |
Inquiry
|
- |
-
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MOQ: 100 MPQ: 1
|
IC CLK BUFFER 1:3 2GHZ 16VFQFN
|
- | 2.375 V ~ 2.625 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) | CML，LVDS，LVPECL | LVDS | 0.04375 | Yes/Yes | 2GHz | ||
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IDT，Integrated Device Technology Inc |
2,239
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:2 156MHZ 8SOIC
|
- | 3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | CMOS | 3-State，CMOS | 0.04305555555555556 | No/No | 156MHz | |||
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IDT，Integrated Device Technology Inc |
965
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:2 156MHZ 8SOIC
|
- | 3 V ~ 5.5 V | 0°C ~ 70°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | CMOS | 3-State，CMOS | 0.04305555555555556 | No/No | 156MHz | |||
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Microchip Technology |
175
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:3 2GHZ 16MLF
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Precision Edge | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，HSTL，LVDS，LVPECL | LVDS | 0.04375 | Yes/Yes | 2GHz | |||
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Microchip Technology |
518
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3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:2 2.5GHZ 16MLF
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Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，HSTL，LVDS，LVPECL | LVPECL | 0.04305555555555556 | Yes/Yes | 2.5GHz | |||
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Microchip Technology |
131
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3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:2 2GHZ 16MLF
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Precision Edge | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，HSTL，LVDS，LVPECL | LVDS | 0.04305555555555556 | Yes/Yes | 2GHz | |||
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Microchip Technology |
253
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，HSTL，LVDS，LVPECL | LVPECL | 0.04375 | Yes/Yes | 2.5GHz | |||
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Microchip Technology |
196
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3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:3 2GHZ 16MLF
|
Precision Edge | 2.375 V ~ 2.625 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，HSTL，LVDS，LVPECL | LVDS | 0.04375 | Yes/Yes | 2GHz | |||
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Microchip Technology |
36
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:2 2GHZ 16MLF
|
Precision Edge | 2.375 V ~ 2.625 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，HSTL，LVDS，LVPECL | LVDS | 0.04305555555555556 | Yes/Yes | 2GHz | |||
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Linear Technology/Analog Devices |
38
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3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:3 1.4GHZ
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- | 3.15 V ~ 3.45 V | -40°C ~ 105°C | 36-WFQFN Exposed Pad | 36-QFN (4x7) | LVCMOS，LVDS，LVPECL | LVCMOS，LVDS | 0.04375 | Yes/Yes | 1.4GHz | |||
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Linear Technology/Analog Devices |
94
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:3 1.4GHZ
|
- | 3.15 V ~ 3.45 V | -40°C ~ 105°C | 36-WFQFN Exposed Pad | 36-QFN (4x7) | LVCMOS，LVDS，LVPECL | LVCMOS，LVDS，LVPECL | 0.04375 | Yes/Yes | 1.4GHz | |||
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Linear Technology/Analog Devices |
5
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3 days |
-
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MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:3 1.4GHZ
|
- | 3.15 V ~ 3.45 V | -40°C ~ 105°C | 36-WFQFN Exposed Pad | 36-QFN (4x7) | LVCMOS，LVDS，LVPECL | LVCMOS，LVDS，LVPECL | 0.04375 | Yes/Yes | 1.4GHz | |||
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Linear Technology/Analog Devices |
4
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC CLK BUFFER 1:3 1.8GHZ
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- | 3.15 V ~ 3.45 V | -40°C ~ 105°C | 36-WFQFN Exposed Pad | 36-QFN (4x7) | LVCMOS，LVDS，LVPECL | LVPECL | 0.04375 | Yes/Yes | 1.8GHz | |||
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Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，HSTL，LVDS，LVPECL | LVPECL | 0.04375 | Yes/Yes | 2.5GHz | |||
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Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 200 MPQ: 1
|
IC CLK BUFFER 1:3 2GHZ 16MLF
|
Precision Edge | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，HSTL，LVDS，LVPECL | LVDS | 0.04375 | Yes/Yes | 2GHz |
