Discover 11 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Interface Operating Temperature Package / Case Supplier Device Package Type Non-Volatile Memory On-Chip RAM Voltage - Core
TMS320C6727BZDH275
Texas Instruments
172
3 days
-
MOQ: 1  MPQ: 1
IC FLOATING POINT DSP 256-BGA
TMS320C672x EBI/EMI,HPI,I2C,McASP,SPI 0°C ~ 90°C (TC) 256-BGA 256-BGA (17x17) Floating Point ROM (384 kB) 288kB 1.20V
DSP56321VF275
NXP USA Inc.
378
3 days
-
MOQ: 1  MPQ: 1
IC DSP 24BIT 275MHZ 196MAPBGA
DSP56K/Symphony Host Interface,SSI,SCI -40°C ~ 100°C (TJ) 196-BGA 196-MAPBGA (15x15) Fixed Point ROM (576 B) 576kB 1.60V
TMS320C6727BZDH275
Texas Instruments
172
3 days
-
MOQ: 1  MPQ: 1
IC FLOATING POINT DSP 256-BGA
TMS320C672x EBI/EMI,HPI,I2C,McASP,SPI 0°C ~ 90°C (TC) 256-BGA 256-BGA (17x17) Floating Point ROM (384 kB) 288kB 1.20V
DSP56321VF275
NXP USA Inc.
378
3 days
-
MOQ: 1  MPQ: 1
IC DSP 24BIT 275MHZ 196MAPBGA
DSP56K/Symphony Host Interface,SSI,SCI -40°C ~ 100°C (TJ) 196-BGA 196-MAPBGA (15x15) Fixed Point ROM (576 B) 576kB 1.60V
DSP56321VL275
NXP USA Inc.
Inquiry
-
-
MOQ: 126  MPQ: 1
IC DSP 24BIT 275MHZ 196MAPBGA
DSP56K/Symphony Host Interface,SSI,SCI -40°C ~ 100°C (TJ) 196-BGA 196-MAPBGA (15x15) Fixed Point ROM (576 B) 576kB 1.60V
MSC8101VT1375F
NXP USA Inc.
Inquiry
-
-
MOQ: 90  MPQ: 1
IC DSP 16BIT 250MHZ 332FCBGA
StarCore Communications Processor Module (CPM) -40°C ~ 105°C (TJ) 332-BFBGA,FCBGA 332-FCBGA (17x17) SC140 Core External 512KB 1.60V
MSC8103VT1100F
NXP USA Inc.
Inquiry
-
-
MOQ: 90  MPQ: 1
IC DSP 16BIT 275MHZ 332FCBGA
StarCore Communications Processor Module (CPM) -40°C ~ 105°C (TJ) 332-BFBGA,FCBGA 332-FCBGA (17x17) SC140 Core External 512KB 1.60V
MSC8101M1375F
NXP USA Inc.
Inquiry
-
-
MOQ: 90  MPQ: 1
DSP 16BIT 275MHZ CPM 332FCBGA
StarCore Communications Processor Module (CPM) -40°C ~ 105°C (TJ) 332-BFBGA,FCBGA 332-FCBGA (17x17) SC140 Core External 512KB 1.60V
MSC8103M1100F
NXP USA Inc.
Inquiry
-
-
MOQ: 90  MPQ: 1
DSP 16BIT 275MHZ CPM 332FCBGA
StarCore Communications Processor Module (CPM) -40°C ~ 105°C (TJ) 332-BFBGA,FCBGA 332-FCBGA (17x17) SC140 Core External 512KB 1.60V
SPAKDSP321VL275
NXP USA Inc.
Inquiry
-
-
MOQ: 126  MPQ: 1
IC DSP 24BIT 275MHZ 196-MAPBGA
DSP56K/Symphony Host Interface,SSI,SCI -40°C ~ 105°C (TJ) 196-BGA 196-MAPBGA (15x15) Fixed Point ROM (576 B) 576kB 1.60V
SPAKDSP321VF275
NXP USA Inc.
Inquiry
-
-
MOQ: 2  MPQ: 1
IC DSP 24BIT 196-MAPBGA
DSP56K/Symphony Host Interface,SSI,SCI -40°C ~ 105°C (TJ) 196-BGA 196-MAPBGA (15x15) Fixed Point ROM (576 B) 576kB 1.60V