- Interface:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Non-Volatile Memory:
-
- On-Chip RAM:
-
- Voltage - Core:
-
- Selected conditions:
Discover 24 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Interface | Operating Temperature | Package / Case | Supplier Device Package | Type | Non-Volatile Memory | On-Chip RAM | Voltage - Core | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Interface | Operating Temperature | Package / Case | Supplier Device Package | Type | Non-Volatile Memory | On-Chip RAM | Voltage - Core | ||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC DSP 16BIT 250MHZ 332FCBGA
|
Communications Processor Module (CPM) | -40°C ~ 75°C (TJ) | 332-BFBGA,FCBGA | 332-FCBGA (17x17) | SC140 Core | External | 512KB | 1.60V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC DSP 16BIT 300MHZ 332FCBGA
|
Communications Processor Module (CPM) | -40°C ~ 75°C (TJ) | 332-BFBGA,FCBGA | 332-FCBGA (17x17) | SC140 Core | External | 512KB | 1.60V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC DSP QUAD 16B 300MHZ 431FCBGA
|
DSI,Ethernet,RS-232 | -40°C ~ 105°C (TJ) | 431-BFBGA,FCBGA | 431-FCPBGA (20x20) | SC140 Core | External | 1.436MB | 1.10V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
DSP 16BIT QUAD 300MHZ 431FCBGA
|
DSI,Ethernet,RS-232 | -40°C ~ 105°C (TJ) | 431-BFBGA,FCBGA | 431-FCPBGA (20x20) | SC140 Core | External | 1.436MB | 1.10V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
DSP 16BIT QUAD 300MHZ 431FCBGA
|
DSI,Ethernet,RS-232 | -40°C ~ 105°C (TJ) | 431-BFBGA,FCBGA | 431-FCPBGA (20x20) | SC140 Core | External | 1.436MB | 1.10V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
DSP 16BIT W/DDR CTRLR 400-MAPBGA
|
Host Interface,I2C,UART | -40°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | Fixed Point | ROM (8 kB) | 464kB | 1.20V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 270 MPQ: 1
|
DSP 16BIT W/DDR CTRLR 400-MAPBGA
|
Host Interface,I2C,UART | -40°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | Fixed Point | ROM (8 kB) | 464kB | 1.20V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
DSP 16BIT W/DDR CTRLR 400-MAPBGA
|
Host Interface,I2C,UART | -40°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | Fixed Point | ROM (8 kB) | 464kB | 1.20V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
DSP 16BIT W/DDR CTRLR 400-MAPBGA
|
Host Interface,I2C,UART | -40°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | Fixed Point | ROM (8 kB) | 464kB | 1.20V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
DSP 16BIT 300MHZ CPM 332FCBGA
|
Communications Processor Module (CPM) | -40°C ~ 75°C (TJ) | 332-BFBGA,FCBGA | 332-FCBGA (17x17) | SC140 Core | External | 512KB | 1.60V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
DSP 16BIT 300MHZ CPM 332FCBGA
|
Communications Processor Module (CPM) | -40°C ~ 75°C (TJ) | 332-BFBGA,FCBGA | 332-FCBGA (17x17) | SC140 Core | External | 512KB | 1.60V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
DSP 16BIT 300MHZ MULTI 431FCBGA
|
DSI,Ethernet,RS-232 | -40°C ~ 105°C (TJ) | 431-BFBGA,FCBGA | 431-FCPBGA (20x20) | SC140 Core | External | 1.436MB | 1.10V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 18 MPQ: 1
|
DSP 16BIT W/DDR CTRLR 400-MAPBGA
|
Host Interface,I2C,UART | -40°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | Fixed Point | ROM (8 kB) | 464kB | 1.20V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 26 MPQ: 1
|
DSP 16BIT W/DDR CTRLR 400-MAPBGA
|
Host Interface,I2C,UART | -40°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | Fixed Point | ROM (8 kB) | 464kB | 1.20V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 22 MPQ: 1
|
DSP 16BIT W/DDR CTRLR 400-MAPBGA
|
Host Interface,I2C,UART | -40°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | Fixed Point | ROM (8 kB) | 464kB | 1.20V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 36 MPQ: 1
|
DSP 16BIT W/DDR CTRLR 400-MAPBGA
|
Host Interface,I2C,UART | -40°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (17x17) | Fixed Point | ROM (8 kB) | 464kB | 1.20V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
DSP DUAL CORE 431FCBGA
|
Ethernet,I2C,TDM,UART | -40°C ~ 105°C (TJ) | 431-BFBGA,FCBGA | 431-FCPBGA (20x20) | SC140 Core | External | 448kB | 1.10V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
DSP DUAL CORE 431FCBGA
|
Ethernet,I2C,TDM,UART | -40°C ~ 105°C (TJ) | 431-BFBGA,FCBGA | 431-FCPBGA (20x20) | SC140 Core | External | 448kB | 1.10V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
DSP TRI-CORE 431FCBGA
|
Ethernet,I2C,TDM,UART | -40°C ~ 105°C (TJ) | 431-BFBGA,FCBGA | 431-FCPBGA (20x20) | SC140 Core | External | 1.436MB | 1.10V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
DSP TRI-CORE 431FCBGA
|
Ethernet,I2C,TDM,UART | -40°C ~ 105°C (TJ) | 431-BFBGA,FCBGA | 431-FCPBGA (20x20) | SC140 Core | External | 1.436MB | 1.10V |