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- Interface:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Non-Volatile Memory:
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- Voltage - I/O:
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- Voltage - Core:
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- Selected conditions:
Discover 16 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Interface | Operating Temperature | Package / Case | Supplier Device Package | Type | Non-Volatile Memory | Voltage - I/O | Voltage - Core | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Interface | Operating Temperature | Package / Case | Supplier Device Package | Type | Non-Volatile Memory | Voltage - I/O | Voltage - Core | ||
Analog Devices Inc. |
36
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DSP LP 512KB L2SR 88LFCSP
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Blackfin | CAN,DSPI,EBI/EMI,I2C,PPI,QSPI,SD/SDIO,SPI,SPORT,UART/USART,USB OTG | 0°C ~ 70°C (TA) | 88-VFQFN Exposed Pad,CSP | 88-LFCSP-VQ (12x12) | Blackfin+ | ROM (512 kB) | 1.8V,3.3V | 1.10V | ||||
Analog Devices Inc. |
74
|
3 days |
-
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MOQ: 1 MPQ: 1
|
BLACKFIN+ PROCESSOR W/ 512KB L2
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Automotive | CAN,DSPI,EBI/EMI,I2C,PPI,QSPI,SD/SDIO,SPI,SPORT,UART/USART,USB OTG | -40°C ~ 105°C (TA) | 88-VFQFN Exposed Pad,CSP | 88-LFCSP-VQ (12x12) | Blackfin+ | ROM (512 kB) | 1.8V,3.3V | 1.10V | ||||
Analog Devices Inc. |
25
|
3 days |
-
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MOQ: 1 MPQ: 1
|
BLK+PROCW/512KB L2 SRAM,DDR2
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Automotive | CAN,DSPI,EBI/EMI,I2C,PPI,QSPI,SD/SDIO,SPI,SPORT,UART/USART,USB OTG | -40°C ~ 105°C (TA) | 184-LFBGA,CSPBGA | 184-CSPBGA (12x12) | Blackfin+ | ROM (512 kB) | 1.8V,3.3V | 1.10V | ||||
Analog Devices Inc. |
Inquiry
|
- |
-
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MOQ: 65 MPQ: 1
|
IC DSP LP 512KB L2SR 88LFCSP
|
Blackfin | CAN,DSPI,EBI/EMI,I2C,PPI,QSPI,SD/SDIO,SPI,SPORT,UART/USART,USB OTG | -40°C ~ 85°C (TA) | 88-VFQFN Exposed Pad,CSP | 88-LFCSP-VQ (12x12) | Blackfin+ | ROM (512 kB) | 1.8V,3.3V | 1.10V | ||||
Analog Devices Inc. |
Inquiry
|
- |
-
|
MOQ: 62 MPQ: 1
|
IC DSP LP 512KB L2SR 184BGA
|
Blackfin | CAN,DSPI,EBI/EMI,I2C,PPI,QSPI,SD/SDIO,SPI,SPORT,UART/USART,USB OTG | 0°C ~ 70°C (TA) | 184-LFBGA,CSPBGA | 184-CSPBGA (12x12) | Blackfin+ | ROM (512 kB) | 1.8V,3.3V | 1.10V | ||||
Analog Devices Inc. |
Inquiry
|
- |
-
|
MOQ: 56 MPQ: 1
|
IC DSP LP 512KB L2SR 184BGA
|
Blackfin | CAN,DSPI,EBI/EMI,I2C,PPI,QSPI,SD/SDIO,SPI,SPORT,UART/USART,USB OTG | -40°C ~ 85°C (TA) | 184-LFBGA,CSPBGA | 184-CSPBGA (12x12) | Blackfin+ | ROM (512 kB) | 1.8V,3.3V | 1.10V | ||||
Analog Devices Inc. |
36
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC DSP LP 512KB L2SR 88LFCSP
|
Blackfin | CAN,DSPI,EBI/EMI,I2C,PPI,QSPI,SD/SDIO,SPI,SPORT,UART/USART,USB OTG | 0°C ~ 70°C (TA) | 88-VFQFN Exposed Pad,CSP | 88-LFCSP-VQ (12x12) | Blackfin+ | ROM (512 kB) | 1.8V,3.3V | 1.10V | ||||
Analog Devices Inc. |
74
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
BLACKFIN+ PROCESSOR W/ 512KB L2
|
Automotive | CAN,DSPI,EBI/EMI,I2C,PPI,QSPI,SD/SDIO,SPI,SPORT,UART/USART,USB OTG | -40°C ~ 105°C (TA) | 88-VFQFN Exposed Pad,CSP | 88-LFCSP-VQ (12x12) | Blackfin+ | ROM (512 kB) | 1.8V,3.3V | 1.10V | ||||
Analog Devices Inc. |
25
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
BLK+PROCW/512KB L2 SRAM,DDR2
|
Automotive | CAN,DSPI,EBI/EMI,I2C,PPI,QSPI,SD/SDIO,SPI,SPORT,UART/USART,USB OTG | -40°C ~ 105°C (TA) | 184-LFBGA,CSPBGA | 184-CSPBGA (12x12) | Blackfin+ | ROM (512 kB) | 1.8V,3.3V | 1.10V | ||||
Analog Devices Inc. |
Inquiry
|
- |
-
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MOQ: 65 MPQ: 1
|
IC DSP LP 512KB L2SR 88LFCSP
|
Blackfin | CAN,DSPI,EBI/EMI,I2C,PPI,QSPI,SD/SDIO,SPI,SPORT,UART/USART,USB OTG | -40°C ~ 85°C (TA) | 88-VFQFN Exposed Pad,CSP | 88-LFCSP-VQ (12x12) | Blackfin+ | ROM (512 kB) | 1.8V,3.3V | 1.10V | ||||
Analog Devices Inc. |
Inquiry
|
- |
-
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MOQ: 62 MPQ: 1
|
IC DSP LP 512KB L2SR 184BGA
|
Blackfin | CAN,DSPI,EBI/EMI,I2C,PPI,QSPI,SD/SDIO,SPI,SPORT,UART/USART,USB OTG | 0°C ~ 70°C (TA) | 184-LFBGA,CSPBGA | 184-CSPBGA (12x12) | Blackfin+ | ROM (512 kB) | 1.8V,3.3V | 1.10V | ||||
Analog Devices Inc. |
Inquiry
|
- |
-
|
MOQ: 56 MPQ: 1
|
IC DSP LP 512KB L2SR 184BGA
|
Blackfin | CAN,DSPI,EBI/EMI,I2C,PPI,QSPI,SD/SDIO,SPI,SPORT,UART/USART,USB OTG | -40°C ~ 85°C (TA) | 184-LFBGA,CSPBGA | 184-CSPBGA (12x12) | Blackfin+ | ROM (512 kB) | 1.8V,3.3V | 1.10V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 90 MPQ: 1
|
IC DSP 16BIT 250MHZ 332FCBGA
|
StarCore | Communications Processor Module (CPM) | -40°C ~ 75°C (TJ) | 332-BFBGA,FCBGA | 332-FCBGA (17x17) | SC140 Core | External | 3.30V | 1.60V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 90 MPQ: 1
|
IC DSP 16BIT 300MHZ 332FCBGA
|
StarCore | Communications Processor Module (CPM) | -40°C ~ 75°C (TJ) | 332-BFBGA,FCBGA | 332-FCBGA (17x17) | SC140 Core | External | 3.30V | 1.60V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 90 MPQ: 1
|
DSP 16BIT 300MHZ CPM 332FCBGA
|
StarCore | Communications Processor Module (CPM) | -40°C ~ 75°C (TJ) | 332-BFBGA,FCBGA | 332-FCBGA (17x17) | SC140 Core | External | 3.30V | 1.60V | ||||
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 90 MPQ: 1
|
DSP 16BIT 300MHZ CPM 332FCBGA
|
StarCore | Communications Processor Module (CPM) | -40°C ~ 75°C (TJ) | 332-BFBGA,FCBGA | 332-FCBGA (17x17) | SC140 Core | External | 3.30V | 1.60V |