Discover 61 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Voltage - Supply Operating Temperature Package / Case Supplier Device Package Number of I/O Number of LABs/CLBs Number of Logic Elements/Cells
EP4CE22E22C8N
Intel
462
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 79 I/O 144EQFP
1.15 V ~ 1.25 V 0°C ~ 85°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 79 1395 22320
EP4CE30F23C8N
Intel
942
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 328 I/O 484FBGA
1.15 V ~ 1.25 V 0°C ~ 85°C (TJ) 484-BGA 484-FBGA (23x23) 328 1803 28848
EP4CE30F29C8N
Intel
216
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 532 I/O 780FBGA
1.15 V ~ 1.25 V 0°C ~ 85°C (TJ) 780-BGA 780-FBGA (29x29) 532 1803 28848
EP4CE22E22C7N
Intel
213
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 79 I/O 144EQFP
1.15 V ~ 1.25 V 0°C ~ 85°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 79 1395 22320
EP4CE22F17C8N
Intel
181
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 153 I/O 256FBGA
1.15 V ~ 1.25 V 0°C ~ 85°C (TJ) 256-LBGA 256-FBGA (17x17) 153 1395 22320
EP4CE30F23C7N
Intel
213
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 328 I/O 484FBGA
1.15 V ~ 1.25 V 0°C ~ 85°C (TJ) 484-BGA 484-FBGA (23x23) 328 1803 28848
EP4CE30F29C7N
Intel
293
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 532 I/O 780FBGA
1.15 V ~ 1.25 V 0°C ~ 85°C (TJ) 780-BGA 780-FBGA (29x29) 532 1803 28848
EP4CE22E22I7N
Intel
521
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 79 I/O 144EQFP
1.15 V ~ 1.25 V -40°C ~ 100°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 79 1395 22320
EP4CE22U14I7N
Intel
200
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 153 I/O 256UBGA
1.15 V ~ 1.25 V -40°C ~ 100°C (TJ) 256-LFBGA 256-UBGA (14x14) 153 1395 22320
EP4CE22F17I7N
Intel
38
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 153 I/O 256FBGA
1.15 V ~ 1.25 V -40°C ~ 100°C (TJ) 256-LBGA 256-FBGA (17x17) 153 1395 22320
EP4CE22F17C6N
Intel
420
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 153 I/O 256FBGA
1.15 V ~ 1.25 V 0°C ~ 85°C (TJ) 256-LBGA 256-FBGA (17x17) 153 1395 22320
EP4CE30F23I7
Intel
57
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 328 I/O 484FBGA
1.15 V ~ 1.25 V -40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 328 1803 28848
EP4CE22F17I8LN
Intel
76
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 153 I/O 256FBGA
0.97 V ~ 1.03 V -40°C ~ 100°C (TJ) 256-LBGA 256-FBGA (17x17) 153 1395 22320
EP4CE30F19A7N
Intel
97
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 193 I/O 324FBGA
1.15 V ~ 1.25 V -40°C ~ 125°C (TJ) 324-BGA 324-FBGA (19x19) 193 1803 28848
EP4CE30F23I7N
Intel
47
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 328 I/O 484FBGA
1.15 V ~ 1.25 V -40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 328 1803 28848
EP4CE22E22I8LN
Intel
79
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 79 I/O 144EQFP
0.97 V ~ 1.03 V -40°C ~ 100°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 79 1395 22320
EP4CE22F17C7N
Intel
72
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 153 I/O 256FBGA
1.15 V ~ 1.25 V 0°C ~ 85°C (TJ) 256-LBGA 256-FBGA (17x17) 153 1395 22320
EP4CE30F29C6N
Intel
77
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 532 I/O 780FBGA
1.15 V ~ 1.25 V 0°C ~ 85°C (TJ) 780-BGA 780-FBGA (29x29) 532 1803 28848
EP4CE30F23C6N
Intel
63
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 328 I/O 484FBGA
1.15 V ~ 1.25 V 0°C ~ 85°C (TJ) 484-BGA 484-FBGA (23x23) 328 1803 28848
EP4CE30F23I8LN
Intel
13
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 328 I/O 484FBGA
0.97 V ~ 1.03 V -40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 328 1803 28848