Discover 6 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Operating Temperature Package / Case Supplier Device Package
XC3SD3400A-4FGG676C
Xilinx Inc.
149
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 469 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27)
XC3SD3400A-4FGG676I
Xilinx Inc.
Inquiry
-
-
MOQ: 40  MPQ: 1
IC FPGA 469 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BGA 676-FBGA (27x27)
XC3SD3400A-4FG676C
Xilinx Inc.
Inquiry
-
-
MOQ: 40  MPQ: 1
IC FPGA 469 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27)
XC3SD3400A-5FGG676C
Xilinx Inc.
Inquiry
-
-
MOQ: 40  MPQ: 1
IC FPGA 469 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27)
XC3SD3400A-4FG676I
Xilinx Inc.
Inquiry
-
-
MOQ: 40  MPQ: 1
IC FPGA 469 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27)
XC3SD3400A-5FG676C
Xilinx Inc.
Inquiry
-
-
MOQ: 40  MPQ: 1
IC FPGA 469 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27)