Package / Case:
Supplier Device Package:
Number of I/O:
Discover 12 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Operating Temperature Package / Case Supplier Device Package Number of I/O
EP4CE55F23I8LN
Intel
17
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 324 I/O 484FBGA
-40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 324
EP4CE55F23C9LN
Intel
Inquiry
-
-
MOQ: 60  MPQ: 1
IC FPGA 324 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BGA 484-FBGA (23x23) 324
EP4CE55F29C9LN
Intel
Inquiry
-
-
MOQ: 36  MPQ: 1
IC FPGA 374 I/O 780FBGA
0°C ~ 85°C (TJ) 780-BGA 780-FBGA (29x29) 374
EP4CE55F23C9L
Intel
Inquiry
-
-
MOQ: 60  MPQ: 1
IC FPGA 324 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BGA 484-FBGA (23x23) 324
EP4CE55F29C9L
Intel
Inquiry
-
-
MOQ: 36  MPQ: 1
IC FPGA 374 I/O 780FBGA
0°C ~ 85°C (TJ) 780-BGA 780-FBGA (29x29) 374
EP4CE55F23C8LN
Intel
Inquiry
-
-
MOQ: 60  MPQ: 1
IC FPGA 324 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BGA 484-FBGA (23x23) 324
EP4CE55F29C8LN
Intel
Inquiry
-
-
MOQ: 36  MPQ: 1
IC FPGA 374 I/O 780FBGA
0°C ~ 85°C (TJ) 780-BGA 780-FBGA (29x29) 374
EP4CE55F23C8L
Intel
Inquiry
-
-
MOQ: 60  MPQ: 1
IC FPGA 324 I/O 484FBGA
0°C ~ 85°C (TJ) 484-BGA 484-FBGA (23x23) 324
EP4CE55F29C8L
Intel
Inquiry
-
-
MOQ: 36  MPQ: 1
IC FPGA 374 I/O 780FBGA
0°C ~ 85°C (TJ) 780-BGA 780-FBGA (29x29) 374
EP4CE55F29I8LN
Intel
Inquiry
-
-
MOQ: 36  MPQ: 1
IC FPGA 374 I/O 780FBGA
-40°C ~ 100°C (TJ) 780-BGA 780-FBGA (29x29) 374
EP4CE55F23I8L
Intel
Inquiry
-
-
MOQ: 60  MPQ: 1
IC FPGA 324 I/O 484FBGA
-40°C ~ 100°C (TJ) 484-BGA 484-FBGA (23x23) 324
EP4CE55F29I8L
Intel
Inquiry
-
-
MOQ: 36  MPQ: 1
IC FPGA 374 I/O 780FBGA
-40°C ~ 100°C (TJ) 780-BGA 780-FBGA (29x29) 374