Discover 1,005 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Operating Temperature Package / Case Supplier Device Package Number of I/O Number of LABs/CLBs Number of Logic Elements/Cells Total RAM Bits
10M08DCF256C8G
Intel
167
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 178 I/O 256FBGA
MAX 10 0°C ~ 85°C (TJ) 256-LBGA 256-FBGA (17x17) 178 500 8000 387072
EP4CE6U14I7N
Intel
475
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 179 I/O 256UBGA
Cyclone IV E -40°C ~ 100°C (TJ) 256-LFBGA 256-UBGA (14x14) 179 392 6272 276480
EP2C5F256C7N
Intel
666
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 158 I/O 256FBGA
Cyclone II 0°C ~ 85°C (TJ) 256-LBGA 256-FBGA (17x17) 158 288 4608 119808
EP3C5U256C8N
Intel
1,123
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 182 I/O 256UBGA
Cyclone III 0°C ~ 85°C (TJ) 256-LFBGA 256-UBGA (14x14) 182 321 5136 423936
10M08DCV81I7G
Intel
1,000
3 days
-
MOQ: 1000  MPQ: 1
IC FPGA 56 I/O 81WLCSP
MAX 10 -40°C ~ 100°C (TJ) 81-UFBGA,WLCSP 81-VBGA,WLCSP (4.5x4.4) 56 500 8000 387072
10M08DCV81I7G
Intel
1,274
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 56 I/O 81WLCSP
MAX 10 -40°C ~ 100°C (TJ) 81-UFBGA,WLCSP 81-VBGA,WLCSP (4.5x4.4) 56 500 8000 387072
10M08DCV81I7G
Intel
1,274
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 56 I/O 81WLCSP
MAX 10 -40°C ~ 100°C (TJ) 81-UFBGA,WLCSP 81-VBGA,WLCSP (4.5x4.4) 56 500 8000 387072
EP2C8T144C8N
Intel
519
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 85 I/O 144TQFP
Cyclone II 0°C ~ 85°C (TJ) 144-LQFP 144-TQFP (20x20) 85 516 8256 165888
EP2C5T144C6N
Intel
433
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 89 I/O 144TQFP
Cyclone II 0°C ~ 85°C (TJ) 144-LQFP 144-TQFP (20x20) 89 288 4608 119808
EP3C5M164C7N
Intel
475
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 106 I/O 164MBGA
Cyclone III 0°C ~ 85°C (TJ) 164-TFBGA 164-MBGA (8x8) 106 321 5136 423936
EP3C5F256C7N
Intel
364
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 182 I/O 256FBGA
Cyclone III 0°C ~ 85°C (TJ) 256-LBGA 256-FBGA (17x17) 182 321 5136 423936
EP4CE6F17I7N
Intel
809
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 179 I/O 256FBGA
Cyclone IV E -40°C ~ 100°C (TJ) 256-LBGA 256-FBGA (17x17) 179 392 6272 276480
EP4CE6F17C6N
Intel
379
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 179 I/O 256FBGA
Cyclone IV E 0°C ~ 85°C (TJ) 256-LBGA 256-FBGA (17x17) 179 392 6272 276480
EP4CE10E22C8N
Intel
373
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 91 I/O 144EQFP
Cyclone IV E 0°C ~ 85°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 91 645 10320 423936
EP2C8Q208C8N
Intel
597
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 138 I/O 208QFP
Cyclone II 0°C ~ 85°C (TJ) 208-BFQFP 208-PQFP (28x28) 138 516 8256 165888
10M08DAF256C8G
Intel
602
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 178 I/O 256FBGA
MAX 10 0°C ~ 85°C (TJ) 256-LBGA 256-FBGA (17x17) 178 500 8000 387072
10M08DAU324C8G
Intel
221
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 246 I/O 324UBGA
MAX 10 0°C ~ 85°C (TJ) 324-LFBGA 324-UBGA (15x15) 246 500 8000 387072
EP3C5E144I7N
Intel
1,242
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 94 I/O 144EQFP
Cyclone III -40°C ~ 100°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 94 321 5136 423936
EP3C10E144C8N
Intel
639
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 94 I/O 144EQFP
Cyclone III 0°C ~ 85°C (TJ) 144-LQFP Exposed Pad 144-EQFP (20x20) 94 645 10320 423936
10M08DCF256I7G
Intel
496
3 days
-
MOQ: 1  MPQ: 1
IC FPGA 178 I/O 256FBGA
MAX 10 -40°C ~ 100°C (TJ) 256-LBGA 256-FBGA (17x17) 178 500 8000 387072