Discover 20 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Operating Temperature Package / Case Supplier Device Package Number of I/O
XCV2000E-6BG560C
Xilinx Inc.
Inquiry
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MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV2000E-6BG560I
Xilinx Inc.
Inquiry
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-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV2000E-6FG1156C
Xilinx Inc.
Inquiry
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-
MOQ: 1  MPQ: 1
IC FPGA 804 I/O 1156FBGA
0°C ~ 85°C (TJ) 1156-BBGA 1156-FBGA (35x35) 804
XCV2000E-6FG1156I
Xilinx Inc.
Inquiry
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-
MOQ: 1  MPQ: 1
IC FPGA 804 I/O 1156FBGA
-40°C ~ 100°C (TJ) 1156-BBGA 1156-FBGA (35x35) 804
XCV2000E-6FG680C
Xilinx Inc.
Inquiry
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-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV2000E-6FG680I
Xilinx Inc.
Inquiry
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-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
-40°C ~ 100°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV2000E-6FG860C
Xilinx Inc.
Inquiry
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-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 860FBGA
0°C ~ 85°C (TJ) 860-BGA 860-FBGA (42.5x42.5) 660
XCV2000E-6FG860I
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 860FBGA
-40°C ~ 100°C (TJ) 860-BGA 860-FBGA (42.5x42.5) 660
XCV2000E-7BG560C
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV2000E-7BG560I
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV2000E-7FG1156C
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 804 I/O 1156FBGA
0°C ~ 85°C (TJ) 1156-BBGA 1156-FBGA (35x35) 804
XCV2000E-7FG1156I
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 804 I/O 1156FBGA
-40°C ~ 100°C (TJ) 1156-BBGA 1156-FBGA (35x35) 804
XCV2000E-7FG680C
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV2000E-7FG680I
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
-40°C ~ 100°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV2000E-7FG860C
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 860FBGA
0°C ~ 85°C (TJ) 860-BGA 860-FBGA (42.5x42.5) 660
XCV2000E-7FG860I
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 860FBGA
-40°C ~ 100°C (TJ) 860-BGA 860-FBGA (42.5x42.5) 660
XCV2000E-8BG560C
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 404 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 404
XCV2000E-8FG1156C
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 804 I/O 1156FBGA
0°C ~ 85°C (TJ) 1156-BBGA 1156-FBGA (35x35) 804
XCV2000E-8FG680C
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 512 I/O 680FBGA
0°C ~ 85°C (TJ) 680-LBGA Exposed Pad 680-FTEBGA (40x40) 512
XCV2000E-8FG860C
Xilinx Inc.
Inquiry
-
-
MOQ: 1  MPQ: 1
IC FPGA 660 I/O 860FBGA
0°C ~ 85°C (TJ) 860-BGA 860-FBGA (42.5x42.5) 660