Discover 28 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Operating Temperature Package / Case Supplier Device Package Number of I/O
XC4052XL-1HQ304C
Xilinx Inc.
Inquiry
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MOQ: 12  MPQ: 1
IC FPGA 256 I/O 304HQFP
0°C ~ 85°C (TJ) 304-BFQFP Exposed Pad 304-PQFP (40x40) 256
XC4052XL-1HQ304I
Xilinx Inc.
Inquiry
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MOQ: 12  MPQ: 1
IC FPGA 256 I/O 304HQFP
-40°C ~ 100°C (TJ) 304-BFQFP Exposed Pad 304-PQFP (40x40) 256
XC4052XL-2HQ304C
Xilinx Inc.
Inquiry
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MOQ: 12  MPQ: 1
IC FPGA 256 I/O 304HQFP
0°C ~ 85°C (TJ) 304-BFQFP Exposed Pad 304-PQFP (40x40) 256
XC4052XL-2HQ304I
Xilinx Inc.
Inquiry
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MOQ: 12  MPQ: 1
IC FPGA 256 I/O 304HQFP
-40°C ~ 100°C (TJ) 304-BFQFP Exposed Pad 304-PQFP (40x40) 256
XC4052XL-3HQ304I
Xilinx Inc.
Inquiry
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MOQ: 12  MPQ: 1
IC FPGA 256 I/O 304HQFP
-40°C ~ 100°C (TJ) 304-BFQFP Exposed Pad 304-PQFP (40x40) 256
XC4052XL-09HQ304C
Xilinx Inc.
Inquiry
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MOQ: 12  MPQ: 1
IC FPGA 256 I/O 304HQFP
0°C ~ 85°C (TJ) 304-BFQFP Exposed Pad 304-PQFP (40x40) 256
XC4052XL-1BG432C
Xilinx Inc.
Inquiry
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MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 352
XC4052XL-1BG432I
Xilinx Inc.
Inquiry
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MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 352
XC4052XL-1BG560C
Xilinx Inc.
Inquiry
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MOQ: 12  MPQ: 1
IC FPGA 352 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 352
XC4052XL-1BG560I
Xilinx Inc.
Inquiry
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MOQ: 12  MPQ: 1
IC FPGA 352 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 352
XC4052XL-1HQ240C
Xilinx Inc.
Inquiry
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MOQ: 24  MPQ: 1
IC FPGA 193 I/O 240HQFP
0°C ~ 85°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 193
XC4052XL-1HQ240I
Xilinx Inc.
Inquiry
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MOQ: 24  MPQ: 1
IC FPGA 193 I/O 240HQFP
-40°C ~ 100°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 193
XC4052XL-2BG432C
Xilinx Inc.
Inquiry
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MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 352
XC4052XL-2BG432I
Xilinx Inc.
Inquiry
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MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 352
XC4052XL-2BG560C
Xilinx Inc.
Inquiry
-
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MOQ: 12  MPQ: 1
IC FPGA 352 I/O 560MBGA
0°C ~ 85°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 352
XC4052XL-2BG560I
Xilinx Inc.
Inquiry
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MOQ: 12  MPQ: 1
IC FPGA 352 I/O 560MBGA
-40°C ~ 100°C (TJ) 560-LBGA Exposed Pad,Metal 560-MBGA (42.5x42.5) 352
XC4052XL-2HQ240C
Xilinx Inc.
Inquiry
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MOQ: 24  MPQ: 1
IC FPGA 193 I/O 240HQFP
0°C ~ 85°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 193
XC4052XL-2HQ240I
Xilinx Inc.
Inquiry
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MOQ: 24  MPQ: 1
IC FPGA 193 I/O 240HQFP
-40°C ~ 100°C (TJ) 240-BFQFP Exposed Pad 240-PQFP (32x32) 193
XC4052XL-3BG432C
Xilinx Inc.
Inquiry
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MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
0°C ~ 85°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 352
XC4052XL-3BG432I
Xilinx Inc.
Inquiry
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MOQ: 21  MPQ: 1
IC FPGA 352 I/O 432MBGA
-40°C ~ 100°C (TJ) 432-LBGA Exposed Pad,Metal 432-MBGA (40x40) 352