Package / Case:
Supplier Device Package:
Number of I/O:
Discover 8 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Operating Temperature Package / Case Supplier Device Package Number of I/O
XC7S75-1FGGA484I
Xilinx Inc.
108
3 days
-
MOQ: 1  MPQ: 1
XC7S75-1FGGA484I
-40°C ~ 100°C (TJ) 484-BBGA,FCBGA 484-FCBGA (23x23) 338
XC7S75-1FGGA676I
Xilinx Inc.
40
3 days
-
MOQ: 1  MPQ: 1
XC7S75-1FGGA676I
-40°C ~ 100°C (TJ) 676-BGA 676-FPBGA (27x27) 400
XC7S75-2FGGA676I
Xilinx Inc.
39
3 days
-
MOQ: 1  MPQ: 1
XC7S75-2FGGA676I
-40°C ~ 100°C (TJ) 676-BGA 676-FPBGA (27x27) 400
XC7S75-2FGGA484I
Xilinx Inc.
16
3 days
-
MOQ: 1  MPQ: 1
XC7S75-2FGGA484I
-40°C ~ 100°C (TJ) 484-BBGA,FCBGA 484-FCBGA (23x23) 338
XC7S75-1FGGA484C
Xilinx Inc.
Inquiry
-
-
MOQ: 5  MPQ: 1
XC7S75-1FGGA484C
0°C ~ 85°C (TJ) 484-BBGA,FCBGA 484-FCBGA (23x23) 338
XC7S75-1FGGA676C
Xilinx Inc.
Inquiry
-
-
MOQ: 4  MPQ: 1
XC7S75-1FGGA676C
0°C ~ 85°C (TJ) 676-BGA 676-FPBGA (27x27) 400
XC7S75-2FGGA484C
Xilinx Inc.
Inquiry
-
-
MOQ: 4  MPQ: 1
XC7S75-2FGGA484C
0°C ~ 85°C (TJ) 484-BBGA,FCBGA 484-FCBGA (23x23) 338
XC7S75-2FGGA676C
Xilinx Inc.
Inquiry
-
-
MOQ: 4  MPQ: 1
XC7S75-2FGGA676C
0°C ~ 85°C (TJ) 676-BGA 676-FPBGA (27x27) 400