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Discover 187 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Applications | Interface | Voltage - Supply | Package / Case | Supplier Device Package | Mounting Type | Core Processor | Number of I/O | RAM Size | Program Memory Type | Controller Series | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Applications | Interface | Voltage - Supply | Package / Case | Supplier Device Package | Mounting Type | Core Processor | Number of I/O | RAM Size | Program Memory Type | Controller Series | |
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Analog Devices Inc. |
153
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 12MHZ 44PLCC
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Tube | Communications Controller | Serial Interface Unit - SDLC/HDLC | 4.5 V ~ 5.5 V | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) | Surface Mount | 8-Bit | 32 | 192 x 8 | External Program Memory | - | ||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 5000 MPQ: 1
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FF IND I2C TPM 4X4 32VQFN CEK
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Tape & Reel (TR) | Trusted Platform Module (TPM) | I2C | 3.3V | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | - | ||
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Microchip Technology |
3,160
|
3 days |
-
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MOQ: 1 MPQ: 1
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FF IND I2C TPM 4X4 32VQFN CEK
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Cut Tape (CT) | Trusted Platform Module (TPM) | I2C | 3.3V | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | - | ||
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Microchip Technology |
3,160
|
3 days |
-
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MOQ: 1 MPQ: 1
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FF IND I2C TPM 4X4 32VQFN CEK
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- | Trusted Platform Module (TPM) | I2C | 3.3V | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | - | ||
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Analog Devices Inc. |
16
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 12MHZ 40DIP
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Tube | Communications Controller | Serial Interface Unit - SDLC/HDLC | 4.5 V ~ 5.5 V | 40-DIP (0.600"，15.24mm) | 40-PDIP | Through Hole | 8-Bit | 32 | 192 x 8 | External Program Memory | - | ||
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NXP USA Inc. |
26
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3 days |
-
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MOQ: 1 MPQ: 1
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IC QUAD HALF-BRIDGE 54SOIC
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Tube | Automotive Mirror Control | SCI，SPI | 8 V ~ 18 V | 54-BSSOP (0.295"，7.50mm Width) Exposed Pad | 54-SOICW-EP | Surface Mount | HC08 | 13 | 512 x 8 | FLASH (16 KB) | 908E | ||
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Infineon Technologies |
Inquiry
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- |
-
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MOQ: 5000 MPQ: 1
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SECURITY ICS/AUTHENTICATION IC
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Tape & Reel (TR) | Embedded Security Trusted Computing | LPC | 3 V ~ 3.6 V | 32-VFQFN Exposed Pad | PG-VQFN-32-13 | Surface Mount | 16-Bit | 1 | - | - | - | ||
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Infineon Technologies |
Inquiry
|
- |
-
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MOQ: 3000 MPQ: 1
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SECURITY ICS/AUTHENTICATION IC
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Tape & Reel (TR) | Embedded Security Trusted Computing | LPC | 3 V ~ 3.6 V | 28-TSSOP (0.173"，4.40mm Width) | PG-TSSOP-28-2 | Surface Mount | 16-Bit | 1 | - | - | - | ||
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Infineon Technologies |
Inquiry
|
- |
-
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MOQ: 5000 MPQ: 1
|
SECURITY ICS/AUTHENTICATION IC
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Tape & Reel (TR) | Embedded Security Trusted Computing | SPI | 1.65 V ~ 3.6 V | 32-VFQFN Exposed Pad | PG-VQFN-32-13 | Surface Mount | 16-Bit | 1 | - | - | - | ||
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Nuvoton Technology Corporation of America |
Inquiry
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- |
-
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MOQ: 250 MPQ: 1
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IC SOC CHIPCORDER AUD 48LQFP
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Tray | Audio Record/Playback | I2C，IrDA，LIN，SPI，UART/USART | 2.5 V ~ 5.5 V | 48-LQFP | 48-LQFP (7x7) | Surface Mount | ARM® Cortex®-M0 | 8 | 12K x 8 | FLASH (145 kB) | - | ||
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STMicroelectronics |
Inquiry
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- |
-
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MOQ: 360 MPQ: 1
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DSP/MCU SYSTEM 144-LQFP
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Tray | Automotive | I2C，I2S，SPI，UART，USB | 1.71 V ~ 1.89 V | 144-LQFP | 144-LQFP (20x20) | Surface Mount | ARM7® | - | 128K x 8 | ROM (384 kB) | - | ||
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Texas Instruments |
Inquiry
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- |
-
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MOQ: 250 MPQ: 1
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IC CPU RISC CAN 128-LQFP
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Tape & Reel (TR) | Connectivity Processor | AAI，ACCESS.bus，CAN，Microwire/SPI，UART/USART | 2.25 V ~ 2.75 V | 48-TFLGA，CSP | 48-PLGA (7x7) | Surface Mount | CR16C | 23 | 10K x 8 | FLASH (256 kB) | CP3000 | ||
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Texas Instruments |
Inquiry
|
- |
-
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MOQ: 500 MPQ: 1
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IC CPU BLUETOOH CAN
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Tape & Reel (TR) | Connectivity Processor | Bluetooth，ACCESS.bus，Audio，CAN，Microwire/SPI，UART，USB | 2.25 V ~ 2.75 V | 144-LQFP | 144-LQFP (20x20) | Surface Mount | CR16C | 48 | 32K x 8 | FLASH (256 kB) | CP3000 | ||
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Texas Instruments |
Inquiry
|
- |
-
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MOQ: 60 MPQ: 1
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IC CPU RISC W/LLC&CAN 144LQFP
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Tray | Connectivity Processor | Bluetooth，ACCESS.bus，Audio，CAN，Microwire/SPI，UART，USB | 2.25 V ~ 2.75 V | 144-LQFP | 144-LQFP (20x20) | Surface Mount | CR16C | 48 | 32K x 8 | FLASH (256 kB) | CP3000 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
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IC SW TRPL HISIDE MCU/LIN 54SOIC
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Tape & Reel (TR) | Automotive Mirror Control | SCI，SPI | 5.5 V ~ 18 V | 54-BSSOP (0.295"，7.50mm Width) | 54-SOIC | Surface Mount | HC08 | 16 | 512 x 8 | FLASH (16 KB) | 908E | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
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IC QUAD HALF-BRIDGE 54SOIC
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Tape & Reel (TR) | Automotive Mirror Control | SCI，SPI | 8 V ~ 18 V | 54-SOIC (0.295"，7.50mm Width) Exposed Pad | 54-SOIC | Surface Mount | HC08 | 13 | 512 x 8 | FLASH (16 KB) | 908E | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 26 MPQ: 1
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IC SW TRPL HISIDE MCU/LIN 54SOIC
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Tube | Automotive Mirror Control | SCI，SPI | 5.5 V ~ 18 V | 54-BSSOP (0.295"，7.50mm Width) | 54-SOIC | Surface Mount | HC08 | 16 | 512 x 8 | FLASH (16 KB) | 908E | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 26 MPQ: 1
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IC QUAD HALF BRDG TRPL SW 54SOIC
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Tube | Automotive Mirror Control | SCI，SPI | 9 V ~ 16 V | 54-BSSOP (0.295"，7.50mm Width) Exposed Pad | 54-SOICW-EP | Surface Mount | HC08 | 12 | 512 x 8 | FLASH (16 KB) | 908E | ||
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Texas Instruments |
Inquiry
|
- |
-
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MOQ: 90 MPQ: 1
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IC CPU RISC W/LLC&USB 100-LQFP
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Tray | Connectivity Processor | Bluetooth，ACCESS.bus，Audio，UART，USB，Microwire/SPI | 2.25 V ~ 2.75 V | 100-LQFP | 100-QFP (14x14) | Surface Mount | CR16C | 37 | 10K x 8 | FLASH (256 kB) | CP3000 | ||
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Texas Instruments |
Inquiry
|
- |
-
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MOQ: 250 MPQ: 1
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IC CPU RISC W/LLC&USB 48-CSP
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Tape & Reel (TR) | Connectivity Processor | Bluetooth，ACCESS.bus，Audio，UART，USB，Microwire/SPI | 2.25 V ~ 2.75 V | 48-TFLGA，CSP | 48-PLGA (7x7) | Surface Mount | CR16C | 21 | 10K x 8 | FLASH (256 kB) | CP3000 |
