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Discover 20 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Applications | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | RAM Size | Controller Series | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Applications | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | RAM Size | Controller Series | |
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NXP USA Inc. |
Inquiry
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-
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MOQ: 2000 MPQ: 1
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IC MCU DUAL LS/HS SWITCH 48LQFP
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Tape & Reel (TR) | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1250 MPQ: 1
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IC MCU DUAL LS/HS SWITCH 48LQFP
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Tray | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC MCU DUAL LS/HS SWITCH 48LQFP
|
Tape & Reel (TR) | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC MCU DUAL LS/HS SWITCH 48LQFP
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Tape & Reel (TR) | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1250 MPQ: 1
|
IC MCU DUAL LS/HS SWITCH 48LQFP
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Tray | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1250 MPQ: 1
|
IC MCU DUAL LS/HS SWITCH 48LQFP
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Tray | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 32KB FLASH 48LQFP
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Tray | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
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Tape & Reel (TR) | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 250 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
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Tray | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 250 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
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Tray | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tape & Reel (TR) | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tape & Reel (TR) | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 250 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tape & Reel (TR) | Automotive | LIN，SCI | 2.25 V ~ 5.5 V | -40°C ~ 105°C | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 260 MPQ: 1
|
MCU 32BIT ENERGY METER 32HVQFN
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Tray | Energy Measurement | I2C，IrDA，SPI，UART/USART | 2.6 V ~ 3.6 V | -40°C ~ 85°C | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM® Cortex®-M0 | 22 | 8K x 8 | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 260 MPQ: 1
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MCU 32BIT ENERGY METER 32HVQFN
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Tray | Energy Measurement | I2C，IrDA，SPI，UART/USART | 2.6 V ~ 3.6 V | -40°C ~ 85°C | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM® Cortex®-M0 | 22 | 8K x 8 | - | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 260 MPQ: 1
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MCU 32BIT ENERGY METER 32HVQFN
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Tray | Energy Measurement | I2C，IrDA，SPI，UART/USART | 2.6 V ~ 3.6 V | -40°C ~ 85°C | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM® Cortex®-M0 | 22 | 8K x 8 | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 260 MPQ: 1
|
MCU 32BIT ENERGY METER 32HVQFN
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Tray | Energy Measurement | I2C，IrDA，SPI，UART/USART | 2.6 V ~ 3.6 V | -40°C ~ 85°C | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM® Cortex®-M0 | 22 | 8K x 8 | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 260 MPQ: 1
|
MCU 32BIT ENERGY METER 32HVQFN
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Tray | Energy Measurement | I2C，IrDA，SPI，UART/USART | 2.6 V ~ 3.6 V | -40°C ~ 85°C | 32-VQFN Exposed Pad | 32-HVQFN (7x7) | ARM® Cortex®-M0 | 22 | 8K x 8 | - | ||
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Cypress Semiconductor Corp |
Inquiry
|
- |
-
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MOQ: 240 MPQ: 1
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IC CAPSENSE 8K FLASH 16SOIC
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- | Capacitive Sensing | I2C，SPI | 1.71 V ~ 5.5 V | -40°C ~ 85°C | 16-SOIC (0.154"，3.90mm Width) | 16-SOIC | M8C | 12 | 1K x 8 | CY8C20xx6A |
