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Discover 36 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Applications | Interface | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | RAM Size | Program Memory Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Applications | Interface | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | RAM Size | Program Memory Type | |
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Microchip Technology |
980
|
3 days |
-
|
MOQ: 1 MPQ: 1
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PRODFF COM I2C TPM 4X4 32VQFN
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Trusted Platform Module (TPM) | I2C | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | ||
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 490 MPQ: 1
|
PRODSTD COM I2C TPM 4X4 32VQFN
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Trusted Platform Module (TPM) | I2C | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | ||
|
|
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Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 490 MPQ: 1
|
PRODFF COM I2C TPM 4X4 32VQFN
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Trusted Platform Module (TPM) | I2C | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | ||
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|
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
|
PRODSTD COM I2C TPM 4X4 32VQFN
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Trusted Platform Module (TPM) | I2C | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | ||
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|
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
|
FF COM I2C TPM 4X4 32VQFN CEK
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Trusted Platform Module (TPM) | I2C | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | ||
|
|
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
|
PRODSTD IND I2C TPM 4X4 32VQFN
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Trusted Platform Module (TPM) | I2C | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | ||
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|
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN CEK
|
Trusted Platform Module (TPM) | I2C | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | ||
|
|
|
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1080 MPQ: 1
|
PRODSTD COM I2C TPM 4X4 32VQFN
|
Trusted Platform Module (TPM) | I2C | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | ||
|
|
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 5000 MPQ: 1
|
PRODSTD IND I2C TPM 4X4 32VQFN
|
Trusted Platform Module (TPM) | I2C | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | ||
|
|
Microchip Technology |
176
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC EMBEDDED CTLR 169LFBGA
|
I/O Controller | ACPI，BC-Link，I2C/SMBus，LPC，PECI，PS/2，SPI | 0°C ~ 85°C | 169-LFBGA | 169-LFBGA (11x11) | ARC-625D | 135 | 16kB | FLASH (192 kB) | |||
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Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
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FF COM SPI TPM 4X4 32VQFN CEK
|
Trusted Platform Module (TPM) | SPI | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | |||
|
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Microchip Technology |
918
|
3 days |
-
|
MOQ: 1 MPQ: 1
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FF IND I2C TPM 4.4MM TSSOP UEK
|
Trusted Platform Module (TPM) | I2C | -40°C ~ 85°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | AVR | 4 | - | - | |||
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Microchip Technology |
976
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4.4MM TSSOP SEK
|
Trusted Platform Module (TPM) | I2C | -40°C ~ 85°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | AVR | 4 | - | - | |||
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Microchip Technology |
833
|
3 days |
-
|
MOQ: 1 MPQ: 1
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PROD FF COM I2C TPM 4X4 32VQFN C
|
Trusted Platform Module (TPM) | I2C | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | |||
|
|
Microchip Technology |
980
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PROD FF COM I2C TPM 4X4 32VQFN U
|
Trusted Platform Module (TPM) | I2C | 0°C ~ 70°C | 32-VQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | |||
|
|
Microchip Technology |
980
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PROD FF COM I2C TPM 4X4 32VQFN S
|
Trusted Platform Module (TPM) | I2C | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | |||
|
|
Microchip Technology |
700
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PROD FF IND I2C TPM 4X4 32VQFN C
|
Trusted Platform Module (TPM) | I2C | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | |||
|
|
Microchip Technology |
820
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PROD FF IND I2C TPM 4X4 32VQFN U
|
Trusted Platform Module (TPM) | I2C | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | |||
|
|
Microchip Technology |
964
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PROD FF IND I2C TPM 4X4 32VQFN S
|
Trusted Platform Module (TPM) | I2C | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - | |||
|
|
Microchip Technology |
677
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PRODSTD COM SPI TPM 4X4 32VQFN
|
Trusted Platform Module (TPM) | SPI | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | - | - |
