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- Voltage - Supply:
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- RAM Size:
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Discover 22 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Applications | Interface | Voltage - Supply | Package / Case | Supplier Device Package | Core Processor | Number of I/O | RAM Size | Controller Series | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Applications | Interface | Voltage - Supply | Package / Case | Supplier Device Package | Core Processor | Number of I/O | RAM Size | Controller Series | ||
Active-Semi International Inc. |
6,640
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC REG BUCK LDO
|
Tray | PAC52xx | Smart Energy Appliances,Devices,and Equipment | I2C,SPI,SWD,UART | - | 48-WFQFN Exposed Pad | 48-TQFN (6x6) | ARM® Cortex®-M0 | 25 | 8K x 8 | PAC® | ||||
Active-Semi International Inc. |
2,590
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
8X8 QFN,48 PINS,0.5 MM PITCH
|
Tray | PAC52xx | Smart Energy Appliances,Devices,and Equipment | I2C,SPI,SWD,UART | 1.8V,3.3V,5V | 43-WFQFN Exposed Pad | 43-TQFN (8x8) | ARM® Cortex®-M0 | 25 | 8K x 8 | PAC® | ||||
Active-Semi International Inc. |
381
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
BLDC MOTOR CTRL + DRV
|
Tray | PAC52xx | Motor Control | I2C,SPI,SWD,UART | 1.8V | 51-VFQFN Exposed Pad | 51-QFN (8x8) | ARM® Cortex®-M0 | 29 | 8K x 8 | PAC® | ||||
Active-Semi International Inc. |
2,400
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC PMU CONV/LDO REG
|
Tray | PAC52xx | Smart Energy Appliances,Devices,and Equipment | I2C,SPI,SWD,UART | - | 57-WFQFN Exposed Pad | 57-TQFN (10x10) | ARM® Cortex®-M0 | 25 | 8K x 8 | PAC® | ||||
Active-Semi International Inc. |
2,391
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
600V POWER APPLICATION CONTROLLE
|
Tray | PAC52xx | Smart Energy Appliances,Devices,and Equipment | I2C,SPI,SWD,UART | 1.8V,3.3V,5V | 57-WFQFN Exposed Pad | 57-TQFN (10x10) | ARM® Cortex®-M0 | 25 | 8K x 8 | PAC® | ||||
Active-Semi International Inc. |
3,214
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC PMU CONV/LDO REG
|
Tray | PAC52xx | Smart Energy Appliances,Devices,and Equipment | I2C,SPI,SWD,UART | - | 56-WFQFN Exposed Pad | 56-TQFN (8x8) | ARM® Cortex®-M0 | 28 | 8K x 8 | PAC® | ||||
Zilog |
168
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MCU 16BIT 32KB FLASH 64-LQFP
|
Tray | Z16FMC | Motor Control | I2C,IrDA,LIN,SPI,UART/USART | 2.7 V ~ 3.6 V | 64-LQFP Exposed Pad | 64-LQFP | Zneo® | 46 | 4K x 8 | Z16FMC | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU DUAL LS/HS SWITCH 48LQFP
|
Tape & Reel (TR) | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
IC MCU DUAL LS/HS SWITCH 48LQFP
|
Tray | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU DUAL LS/HS SWITCH 48LQFP
|
Tape & Reel (TR) | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU DUAL LS/HS SWITCH 48LQFP
|
Tape & Reel (TR) | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
IC MCU DUAL LS/HS SWITCH 48LQFP
|
Tray | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1250 MPQ: 1
|
IC MCU DUAL LS/HS SWITCH 48LQFP
|
Tray | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tape & Reel (TR) | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 250 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 250 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tape & Reel (TR) | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tape & Reel (TR) | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 250 MPQ: 1
|
IC MCU 16BIT 32KB FLASH 48LQFP
|
Tray | - | Automotive | LIN,SCI | 2.25 V ~ 5.5 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | S12 | 9 | 2K x 8 | HCS12 |