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Discover 177 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Applications | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Core Processor | RAM Size | Program Memory Type | Controller Series | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Applications | Interface | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Core Processor | RAM Size | Program Memory Type | Controller Series | |
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Microchip Technology |
Inquiry
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MOQ: 0 MPQ: 1
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MEM FF IND I2C TPM 28TSSOP
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Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | - | - | - | ||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 0 MPQ: 1
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MEM FF IND I2C TPM 28TSSOP
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Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | - | - | - | ||
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Microchip Technology |
Inquiry
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- |
-
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MOQ: 0 MPQ: 1
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MEM FF IND I2C TPM 28TSSOP
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Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | - | - | - | ||
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Melexis Technologies NV |
Inquiry
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- |
-
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MOQ: 0 MPQ: 1
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IC LIN RGB 32KB 16KROM 4IO 8SOIC
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Tape & Reel (TR) | - | LIN Controller | SPI | 5.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | 16-Bit RISC | 2K x 8 | FLASH (32 kB)，ROM (16 kB) | - | ||
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Melexis Technologies NV |
Inquiry
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- |
-
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MOQ: 0 MPQ: 1
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IC LIN-TO-LIN GW CTRLR 12DFN
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Tape & Reel (TR) | - | LIN Controller | UART | 5.5 V ~ 18 V | -40°C ~ 125°C (TA) | 12-VFDFN Exposed Pad | 12-DFN (4x4) | Surface Mount | 16-Bit RISC | 2K x 8 | FLASH (32 kB)，ROM (16 kB) | - | ||
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Microchip Technology |
1,000
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3 days |
-
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MOQ: 1000 MPQ: 1
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FF COM SPI TPM 4X4 32VQFN CEK
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- | - | Trusted Platform Module (TPM) | SPI | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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FF COM SPI TPM 4X4 32VQFN CEK
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Tray | - | Trusted Platform Module (TPM) | SPI | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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FF COM SPI TPM 4X4 32VQFN CEK
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- | - | Trusted Platform Module (TPM) | SPI | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
948
|
3 days |
-
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MOQ: 1 MPQ: 1
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FF COM I2C TPM 4.4MM TSSOP UEK
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Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
972
|
3 days |
-
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MOQ: 1 MPQ: 1
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FF COM I2C TPM 4.4MM TSSOP SEK
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Tube | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1000 MPQ: 1
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FF IND I2C TPM 4X4 32VQFN UEK
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Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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FF IND I2C TPM 4X4 32VQFN UEK
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Cut Tape (CT) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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FF IND I2C TPM 4X4 32VQFN UEK
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- | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
918
|
3 days |
-
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MOQ: 1 MPQ: 1
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FF IND I2C TPM 4.4MM TSSOP UEK
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Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1000 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN SEK
|
Tape & Reel (TR) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1 MPQ: 1
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FF IND I2C TPM 4X4 32VQFN SEK
|
Cut Tape (CT) | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
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FF IND I2C TPM 4X4 32VQFN SEK
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- | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
976
|
3 days |
-
|
MOQ: 1 MPQ: 1
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FF IND I2C TPM 4.4MM TSSOP SEK
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Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | -40°C ~ 85°C | 28-TSSOP (0.173"，4.40mm Width) | 28-TSSOP | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
833
|
3 days |
-
|
MOQ: 1 MPQ: 1
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PROD FF COM I2C TPM 4X4 32VQFN C
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Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | - | - | - | |||
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Microchip Technology |
980
|
3 days |
-
|
MOQ: 1 MPQ: 1
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PROD FF COM I2C TPM 4X4 32VQFN U
|
Tray | - | Trusted Platform Module (TPM) | I2C | 3.3V | 0°C ~ 70°C | 32-VQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | - | - | - |
