- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Peripherals:
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- Core Processor:
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- Number of I/O:
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- Speed:
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- RAM Size:
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- Program Memory Size:
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- Program Memory Type:
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- Data Converters:
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Discover 8,167 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | ||
NXP USA Inc. |
6,000
|
3 days |
-
|
MOQ: 6000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
Tape & Reel (TR) | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset,DMA,POR,PWM,WDT | ARM Cortex-M0+ | 29 | 30MHz | 8K x 8 | 32KB (32K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 12x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
7,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
Cut Tape (CT) | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset,DMA,POR,PWM,WDT | ARM Cortex-M0+ | 29 | 30MHz | 8K x 8 | 32KB (32K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 12x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
7,619
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
- | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset,DMA,POR,PWM,WDT | ARM Cortex-M0+ | 29 | 30MHz | 8K x 8 | 32KB (32K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 12x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 8SOIC
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | LVD,POR,PWM,WDT | S08 | 4 | 16MHz | 256 x 8 | 4KB (4K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 4x10b | Internal | - | 8-Bit | ||||
NXP USA Inc. |
6,911
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 8SOIC
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | LVD,POR,PWM,WDT | S08 | 4 | 16MHz | 256 x 8 | 4KB (4K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 4x10b | Internal | - | 8-Bit | ||||
NXP USA Inc. |
6,911
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4KB FLASH 8SOIC
|
- | S08 | -40°C ~ 85°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | LVD,POR,PWM,WDT | S08 | 4 | 16MHz | 256 x 8 | 4KB (4K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 4x10b | Internal | - | 8-Bit | ||||
NXP USA Inc. |
15,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Tape & Reel (TR) | Kinetis KL03 | -40°C ~ 85°C (TA) | 20-UFBGA,WLCSP | 20-WLCSP (2x1.61) | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 18 | 48MHz | 2K x 8 | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 7x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
19,598
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Cut Tape (CT) | Kinetis KL03 | -40°C ~ 85°C (TA) | 20-UFBGA,WLCSP | 20-WLCSP (2x1.61) | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 18 | 48MHz | 2K x 8 | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 7x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
19,598
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
- | Kinetis KL03 | -40°C ~ 85°C (TA) | 20-UFBGA,WLCSP | 20-WLCSP (2x1.61) | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 18 | 48MHz | 2K x 8 | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 7x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
3,000
|
3 days |
-
|
MOQ: 3000 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Tape & Reel (TR) | Kinetis KL02 | -40°C ~ 85°C (TA) | 20-UFBGA,WLCSP | 20-WLCSP (1.99x1.94) | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 18 | 48MHz | 4K x 8 | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 10x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
5,559
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
Cut Tape (CT) | Kinetis KL02 | -40°C ~ 85°C (TA) | 20-UFBGA,WLCSP | 20-WLCSP (1.99x1.94) | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 18 | 48MHz | 4K x 8 | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 10x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
5,559
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 20WLCSP
|
- | Kinetis KL02 | -40°C ~ 85°C (TA) | 20-UFBGA,WLCSP | 20-WLCSP (1.99x1.94) | Brown-out Detect/Reset,LVD,POR,PWM,WDT | ARM Cortex-M0+ | 18 | 48MHz | 4K x 8 | 32KB (32K x 8) | Flash | - | 1.71 V ~ 3.6 V | A/D 10x12b | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
14,340
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 16KB FLASH 20TSSOP
|
Tube | LPC81xM | -40°C ~ 105°C (TA) | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | Brown-out Detect/Reset,POR,PWM,WDT | ARM Cortex-M0+ | 18 | 30MHz | 4K x 8 | 16KB (16K x 8) | Flash | - | 1.8 V ~ 3.6 V | - | Internal | I2C,SPI,UART/USART | 32-Bit | ||||
NXP USA Inc. |
5,000
|
3 days |
-
|
MOQ: 5000 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | LVD,POR,PWM,WDT | S08 | 12 | 20MHz | 512 x 8 | 8KB (8K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
7,413
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | LVD,POR,PWM,WDT | S08 | 12 | 20MHz | 512 x 8 | 8KB (8K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
7,413
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 8KB FLASH 16TSSOP
|
- | S08 | -40°C ~ 85°C (TA) | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | LVD,POR,PWM,WDT | S08 | 12 | 20MHz | 512 x 8 | 8KB (8K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 8x10b | Internal | I2C,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
22,500
|
3 days |
-
|
MOQ: 2500 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 28TSSOP
|
Tape & Reel (TR) | S08 | -40°C ~ 85°C (TA) | 28-TSSOP (0.173",4.40mm Width) | 28-TSSOP | LVD,POR,PWM,WDT | S08 | 22 | 40MHz | 1K x 8 | 16KB (16K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 16x10b | Internal | I2C,LINbus,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
24,998
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 28TSSOP
|
Cut Tape (CT) | S08 | -40°C ~ 85°C (TA) | 28-TSSOP (0.173",4.40mm Width) | 28-TSSOP | LVD,POR,PWM,WDT | S08 | 22 | 40MHz | 1K x 8 | 16KB (16K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 16x10b | Internal | I2C,LINbus,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
24,998
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 8BIT 16KB FLASH 28TSSOP
|
- | S08 | -40°C ~ 85°C (TA) | 28-TSSOP (0.173",4.40mm Width) | 28-TSSOP | LVD,POR,PWM,WDT | S08 | 22 | 40MHz | 1K x 8 | 16KB (16K x 8) | Flash | - | 2.7 V ~ 5.5 V | A/D 16x10b | Internal | I2C,LINbus,SCI,SPI | 8-Bit | ||||
NXP USA Inc. |
1,482
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 32KB FLASH 32HVQFN
|
Tray | LPC82x | -40°C ~ 105°C (TA) | 32-VFQFN Exposed Pad | 32-HVQFN (5x5) | Brown-out Detect/Reset,DMA,POR,PWM,WDT | ARM Cortex-M0+ | 29 | 30MHz | 8K x 8 | 32KB (32K x 8) | Flash | - | 1.8 V ~ 3.6 V | A/D 12x12b | Internal | I2C,SPI,UART/USART | 32-Bit |