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Discover 287 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | |
|
|
|
NXP USA Inc. |
734
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
440
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
305
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 450MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
368
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 450MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
98
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 450MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
79
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 333MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
122
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
102
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
101
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
75
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 352TBGA
|
-40°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 333MHz | - | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
184
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 200MHz | - | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
139
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 352TBGA
|
0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 333MHz | - | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
29
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 333MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
1,376
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 357BGA
|
0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 266MHz | - | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
265
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 352TBGA
|
0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 266MHz | - | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
45
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 350MHZ 352TBGA
|
0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 350MHz | - | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
26
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 266MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
74
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | - |
