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Discover 26 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
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NXP USA Inc. |
1,424
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6SX 800MHZ 529MAPBGA
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Tray | i.MX6SX | -40°C ~ 105°C (TA) | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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NXP USA Inc. |
564
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6SX 800MHZ 529MAPBGA
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Tray | i.MX6SX | -40°C ~ 125°C (TJ) | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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NXP USA Inc. |
166
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6SX 1GHZ 529MAPBGA
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Tray | i.MX6SX | -20°C ~ 105°C (TJ) | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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NXP USA Inc. |
420
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX51 800MHZ 529BGA
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Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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NXP USA Inc. |
161
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX51 800MHZ 529BGA
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Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | No | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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NXP USA Inc. |
420
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX51 600MHZ 529BGA
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Tray | i.MX51 | -40°C ~ 95°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 600MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | No | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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NXP USA Inc. |
39
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX51 600MHZ 529BGA
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Tray | i.MX51 | -40°C ~ 95°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 600MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | No | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 750 MPQ: 1
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IC MPU I.MX51 800MHZ 529BGA
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Tape & Reel (TR) | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 420 MPQ: 1
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IC MPU I.MX51 800MHZ 529BGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | No | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 750 MPQ: 1
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IC MPU I.MX51 600MHZ 529BGA
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Tape & Reel (TR) | i.MX51 | -40°C ~ 95°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 600MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | No | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 420 MPQ: 1
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IC MPU I.MX51 600MHZ 529BGA
|
Tray | i.MX51 | -40°C ~ 125°C (TJ) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 600MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 750 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tape & Reel (TR) | i.MX51 | -40°C ~ 95°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 600MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 420 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tray | i.MX51 | -40°C ~ 125°C (TJ) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 600MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 420 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tray | i.MX51 | -40°C ~ 95°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 600MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 84 MPQ: 1
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IC MPU I.MX51 800MHZ 529MAPBGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | Boot Security，Cryptography，Hardware ID，RTIC，Secure JTAG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 750 MPQ: 1
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IC MPU I.MX51 800MHZ 529BGA
|
Tape & Reel (TR) | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | No | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 750 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tape & Reel (TR) | i.MX51 | -40°C ~ 95°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 600MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | No | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 750 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tape & Reel (TR) | i.MX51 | -20°C ~ 85°C (TC) | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2 | No | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 750 MPQ: 1
|
I.MX 6 SERIES 32-BIT MPU ARM CO
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Tape & Reel (TR) | i.MX6SX | -40°C ~ 125°C (TJ) | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 750 MPQ: 1
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I.MX6SX ROM PERF ENHAN
|
Tape & Reel (TR) | i.MX6SX | -40°C ~ 125°C (TJ) | 529-MAPBGA (19x19) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD，LVDS | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE |
