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Discover 48 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | USB | Security Features | |
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NXP USA Inc. |
3,535
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX35 532MHZ 400MAPBGA
|
Tray | i.MX35 | -40°C ~ 85°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | LPDDR，DDR2 | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG，Tamper Detection | ||
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NXP USA Inc. |
265
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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NXP USA Inc. |
728
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX35 532MHZ 400MAPBGA
|
Tray | i.MX35 | -40°C ~ 85°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | LPDDR，DDR2 | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG，Tamper Detection | ||
|
|
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NXP USA Inc. |
744
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX35 532MHZ 400MAPBGA
|
Tray | i.MX35 | -20°C ~ 70°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | LPDDR，DDR2 | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG，Tamper Detection | ||
|
|
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NXP USA Inc. |
155
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
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NXP USA Inc. |
171
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 125°C (TJ) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
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|
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NXP USA Inc. |
450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
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|
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NXP USA Inc. |
189
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX35 532MHZ 400MAPBGA
|
Tray | i.MX35 | -20°C ~ 70°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | LPDDR，DDR2 | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG，Tamper Detection | ||
|
|
|
NXP USA Inc. |
268
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX35 532MHZ 400MAPBGA
|
Tray | i.MX35 | -40°C ~ 85°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | LPDDR，DDR2 | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG | ||
|
|
|
NXP USA Inc. |
450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU 32BIT I.MX6 800MHZ 400BGA
|
Tray | i.MX6SX | -20°C ~ 105°C (TJ) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，1GHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU 32BIT I.MX6 800MHZ 400BGA
|
Tray | i.MX6SX | -40°C ~ 105°C (TA) | ARM® Cortex®-A9，ARM® Cortex®-M4 | 1.8V，2.5V，2.8V，3.15V | 200MHz，800MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | 10/100/1000 Mbps (2) | USB 2.0 + PHY (1)，USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CAAM，CSU，SNVS，System JTAG，TVDECODE | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
|
IC MPU I.MX35 532MHZ 400MAPBGA
|
Tape & Reel (TR) | i.MX35 | -40°C ~ 85°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | LPDDR，DDR2 | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG，Tamper Detection | ||
|
|
|
NXP USA Inc. |
450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tape & Reel (TR) | i.MX50 | 0°C ~ 70°C (TA) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | EPDC，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tape & Reel (TR) | i.MX50 | 0°C ~ 70°C (TA) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1000 MPQ: 1
|
IC MPU I.MX35 532MHZ 400MAPBGA
|
Tape & Reel (TR) | i.MX35 | -20°C ~ 70°C (TA) | ARM1136JF-S | 1.8V，2.0V，2.5V，2.7V，3.0V，3.3V | 532MHz | 1 Core，32-Bit | Multimedia; GPU，IPU，VFP | LPDDR，DDR2 | Keypad，KPP，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Secure Fusebox，Secure JTAG，Tamper Detection | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | -20°C ~ 70°C (TA) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | LCD | 10/100 Mbps (1) | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG |
