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- Supplier Device Package：
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- Voltage - I/O：
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Discover 136 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 500 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324LFBGA
|
Tape & Reel (TR) | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | 1.2V，1.8V，3.3V | 536MHz | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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|
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Microchip Technology |
1,889
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT 160KB ROM 324LFBGA
|
Cut Tape (CT) | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | 1.2V，1.8V，3.3V | 536MHz | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
|
|
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Microchip Technology |
1,889
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MCU 32BIT 160KB ROM 324LFBGA
|
- | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | 1.2V，1.8V，3.3V | 536MHz | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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Microchip Technology |
3,968
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MCU 32BIT 160KB ROM 324LFBGA
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Tray | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | 1.2V，1.8V，3.3V | 536MHz | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324TFBGA
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Tape & Reel (TR) | SAMA5D3 | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (12x12) | 1.2V，1.8V，3.3V | 536MHz | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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|
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Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324TFBGA
|
Cut Tape (CT) | SAMA5D3 | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (12x12) | 1.2V，1.8V，3.3V | 536MHz | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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|
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Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324TFBGA
|
- | SAMA5D3 | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (12x12) | 1.2V，1.8V，3.3V | 536MHz | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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|
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Microchip Technology |
53
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324TFBGA
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Tray | SAMA5D3 | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (12x12) | 1.2V，1.8V，3.3V | 536MHz | - | LPDDR，LPDDR2，DDR2 | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 0 MPQ: 1
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IC MCU 32BIT 289LFBGA
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Tray | SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC MCU 32BIT 289LFBGA
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Tape & Reel (TR) | SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 0 MPQ: 1
|
IC MCU 32BIT 289LFBGA
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Tray | SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 0 MPQ: 1
|
IC MCU 32BIT 289LFBGA
|
Tape & Reel (TR) | SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
Microchip Technology |
587
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
230
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
243
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN，IND TEMP,MRLC,512MBIT
|
Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
1,500
|
3 days |
-
|
MOQ: 1500 MPQ: 1
|
IC MCU 32BIT EXT MEM 196TFBGA
|
Tape & Reel (TR) | SAMA5D2 | -40°C ~ 105°C (TA) | 196-TFBGA，CSBGA | 196-TFBGA (11x11) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
1,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 196TFBGA
|
Cut Tape (CT) | SAMA5D2 | -40°C ~ 105°C (TA) | 196-TFBGA，CSBGA | 196-TFBGA (11x11) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
1,500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 196TFBGA
|
- | SAMA5D2 | -40°C ~ 105°C (TA) | 196-TFBGA，CSBGA | 196-TFBGA (11x11) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
2,000
|
3 days |
-
|
MOQ: 2000 MPQ: 1
|
IC MCU 32BIT EXT MEM 256TFBGA
|
Tape & Reel (TR) | SAMA5D2 | -40°C ~ 85°C (TA) | 256-TFBGA | 256-TFBGA (8x8) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
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Microchip Technology |
2,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 256TFBGA
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Cut Tape (CT) | SAMA5D2 | -40°C ~ 85°C (TA) | 256-TFBGA | 256-TFBGA (8x8) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Yes | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC |
