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Discover 112 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
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Texas Instruments |
1,668
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MOD ARM CORTEX-A9 491NFBGA
|
Tray | Sitara | -40°C ~ 105°C (TJ) | 491-LFBGA | 491-NFBGA (17x17) | 1.8V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | TSC，WXGA | 10/100/1000 Mbps (2) | USB 2.0 + PHY (2) | Crypto Accelerator | ||
|
|
|
Renesas Electronics America |
220
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LFBGA
|
Tray | RZ/A1L | -40°C ~ 85°C (TA) | 176-LFBGA | 176-LFBGA (8x8) | 1.2V，3.3V | 400MHz | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | VDC | 10/100 Mbps | USB 2.0 (2) | - | ||
|
|
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NXP USA Inc. |
1,129
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
230
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
1,173
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
1,825
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | 1.8V，2.5V，2.8V，3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
446
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | 1.8V，2.5V，2.8V，3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
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Renesas Electronics America |
164
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LFQFP
|
Tray | RZ/A1L | -40°C ~ 85°C (TA) | 176-LQFP | 176-LFQFP (24x24) | 1.2V，3.3V | 400MHz | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | VDC | 10/100 Mbps | USB 2.0 (2) | - | ||
|
|
|
NXP USA Inc. |
313
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
773
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
Texas Instruments |
2,087
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MOD ARM CORTEX-A9 491NFBGA
|
Tray | Sitara | -40°C ~ 105°C (TJ) | 491-LFBGA | 491-NFBGA (17x17) | 1.8V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | Yes | TSC，WXGA | 10/100/1000 Mbps (2) | USB 2.0 + PHY (2) | Crypto Accelerator | ||
|
|
|
NXP USA Inc. |
761
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 105°C (TA) | 624-LFBGA | 624-MAPBGA (21x21) | 1.8V，2.5V，2.8V，3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
1,385
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
1,353
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100 Mbps (1) | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
653
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | 1.8V，2.5V，2.8V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | Keypad，LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
Texas Instruments |
186
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
AEGIS 1.3 .8G EXT TEMP
|
Tray | Sitara | -40°C ~ 105°C (TJ) | 491-LFBGA | 491-NFBGA (17x17) | 1.8V，3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | TSC，WXGA | 10/100/1000 Mbps (2) | USB 2.0 + PHY (2) | Crypto Accelerator | ||
|
|
|
Renesas Electronics America |
250
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
RZ/A1H 400MHZ 10MB BGA324
|
Tray | RZ/A1H | -40°C ~ 85°C (TA) | 324-BGA | 324-FBGA (19x19) | 1.2V，3.3V | 400MHz | Multimedia; NEON® MPE | SDRAM，SRAM | Yes | DVD，VDC | 10/100 Mbps (1)，100 Mbps (1) | USB 2.0 (2) | - | ||
|
|
|
NXP USA Inc. |
146
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6 32BIT MPU 1GHZ 432MAPBGA
|
Tray | i.MX6SLL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | 1.2V，1.8V，2.5V，3.3V | 1GHz | Multimedia; NEON® SIMD | LPDDR2，LPDDR3 | Yes | EPDC，LCD | - | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
137
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX6 32BIT MPU 800MHZ 400MAPBGA
|
Tray | i.MX6SLL | -40°C ~ 105°C (TJ) | 400-LFBGA | 400-MAPBGA (14x14) | 1.2V，1.8V，2.5V，3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2，LPDDR3 | Yes | EPDC，LCD | - | USB 2.0 OTG + PHY (2) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
|
Texas Instruments |
115
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
MOD ARM CORTEX-A9 491NFBGA
|
Tray | Sitara | -40°C ~ 90°C (TJ) | 491-LFBGA | 491-NFBGA (17x17) | 1.8V，3.3V | 300MHz | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | No | TSC，WXGA | 10/100/1000 Mbps (2) | USB 2.0 + PHY (2) | Crypto Accelerator |
