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Discover 119 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Speed | Number of Cores/Bus Width | RAM Controllers | Display & Interface Controllers | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Speed | Number of Cores/Bus Width | RAM Controllers | Display & Interface Controllers | USB | Security Features | |
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NXP USA Inc. |
936
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX6D 800MHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | 800MHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
770
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | 1.0GHz | 4 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
395
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | 1.0GHz | 4 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
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NXP USA Inc. |
888
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
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Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | 1.0GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
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NXP USA Inc. |
592
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 800MHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | 800MHz | 4 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
|
NXP USA Inc. |
788
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | 1.0GHz | 4 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
514
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | 1.0GHz | 4 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
165
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | 1.0GHz | 4 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
169
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX6QP 1GHZ 624FCBGA
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Tray | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | 1.0GHz | 4 Core，32-Bit | LPDDR2，DDR3L，DDR3 | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
510
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX6QP 800MHZ 624FCBGA
|
Tray | i.MX6QP | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | 800MHz | 4 Core，32-Bit | LPDDR2，DDR3L，DDR3 | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
473
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | 1.0GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
116
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX6DP 1GHZ 624FCBGA
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Tray | i.MX6DP | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | 1.0GHz | 2 Core，32-Bit | LPDDR2，DDR3L，DDR3 | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
500
|
3 days |
-
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MOQ: 500 MPQ: 1
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IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tape & Reel (TR) | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | 1.0GHz | 4 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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NXP USA Inc. |
59
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP ENHAN 624FCBGA
|
Tray | i.MX6QP | -40°C ~ 105°C (TA) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | 800MHz | 4 Core，32-Bit | LPDDR2，DDR3L，DDR3 | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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|
|
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tape & Reel (TR) | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | 1.0GHz | 4 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
|
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCPBGA (21x21) | 1.0GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
66
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA，FCBGA | 624-FCBGA (21x21) | 1.0GHz | 2 Core，32-Bit | LPDDR2，LVDDR3，DDR3 | Keypad，LCD | USB 2.0 + PHY (4) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
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|
|
NXP USA Inc. |
46
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP ENHAN 624FCBGA
|
Tray | i.MX6QP | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCBGA (21x21) | 1.0GHz | 4 Core，32-Bit | LPDDR2，DDR3L，DDR3 | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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|
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NXP USA Inc. |
68
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP 1GHZ 624FCBGA
|
Tray | i.MX6DP | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCBGA (21x21) | 1.0GHz | 2 Core，32-Bit | LPDDR2，DDR3L，DDR3 | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
31
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP 1GHZ 624FCBGA
|
Tray | i.MX6QP | -20°C ~ 105°C (TJ) | 624-LFBGA，FCBGA | 624-FCBGA (21x21) | 1.0GHz | 4 Core，32-Bit | LPDDR2，DDR3L，DDR3 | HDMI，Keypad，LCD，LVDS，MIPI/DSI，Parallel | USB 2.0 + PHY (3)，USB 2.0 OTG + PHY (1) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS |
