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Discover 69 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | USB | Security Features | |
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NXP USA Inc. |
35
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3 days |
-
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MOQ: 1 MPQ: 1
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I.MX 8MQUAD 17X17 NO LID
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Tray | - | 0°C ~ 95°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 1.3GHz | 4 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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NXP USA Inc. |
10
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX 8MQUAD LT 17X17 NOL
|
Tray | - | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 1.5GHz | 4 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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NXP USA Inc. |
85
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX 8MDUAL 17X17 NO LID
|
Tray | - | 0°C ~ 95°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 1.3GHz | 2 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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NXP USA Inc. |
72
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX 8M QUADLITE，ARM CORTEX-A53
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Tray | - | 0°C ~ 95°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 1.3GHz | 4 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
55
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX 8MQUAD 17X17 NO LID
|
Tray | - | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 1.5GHz | 4 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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Advantech Corp |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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CPU CORE 2.3G 6M 35W
|
Tray | Skylake | - | Module | - | i5-6500TE | 2.3GHz | 4 Core，64-Bit | - | - | - | - | - | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
I.MX 8MDUAL 17X17 NO LID
|
Tray | - | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 1.5GHz | 2 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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Silicon Motion，Inc. |
420
|
3 days |
-
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MOQ: 1 MPQ: 1
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VOYAGERGX 8MB PB FREE
|
- | - | 0°C ~ 70°C | 297-BGA | 297-BGA (19x19) | SM502 | 240MHz | 1 Core | - | SDR | - | - | USB 1.1 (1) | - | ||
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Silicon Motion，Inc. |
395
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
VOYAGERGX 8MB PB FREE + EXT. TEM
|
- | - | -40°C ~ 85°C | 297-BGA | 297-BGA (19x19) | SM502 | 240MHz | 1 Core | - | SDR | - | - | USB 1.1 (1) | - | ||
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Silicon Motion，Inc. |
50
|
3 days |
-
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MOQ: 1 MPQ: 1
|
VOYAGERGX 0MB PB FREE
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- | - | 0°C ~ 70°C | 297-BGA | 297-BGA (19x19) | SM502 | 240MHz | 1 Core | - | SDR | - | - | USB 1.1 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
I.MX 8MDUAL 17X17 NO LID 621FBGA
|
Tray | - | 0°C ~ 95°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 1.3GHz | 2 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
I.MX 8MQUAD CORTEX-A53 621FBGA
|
Tray | - | 0°C ~ 95°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 1.3GHz | 4 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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Advantech Corp |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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CELERON 2.8G 2M 1151P G3900
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Tray | Skylake | - | 1151-LGA Module | 1151-LGA | Celeron G3900 | 2.8GHz | 2 Core，64-Bit | - | DDR3L，DDR4 | - | - | - | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
I.MX 8MQUAD 17X17 NO LID 621FBGA
|
Tray | - | 0°C ~ 95°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 1.3GHz | 4 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
I.MX 8MDUAL 17X17 NO LID 621FBGA
|
Tray | - | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 1.5GHz | 2 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
I.MX 8MQUAD 17X17 NO LID 621FBGA
|
Tray | - | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 1.5GHz | 4 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
I.MX 8MQUAD 17X17 NO LID 621FBGA
|
Tray | - | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 1.5GHz | 4 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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|
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Advantech Corp |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CELERON 2.3G 2M 1151P G3900TE
|
Tray | Skylake | - | 1151-LGA Module | 1151-LGA | Celeron G3900TE | 2.3GHz | 2 Core，64-Bit | - | DDR3L，DDR4 | - | - | - | - | ||
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|
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Advantech Corp |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
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PENTIUM 3.0G 3M 1151P 2 CORE G44
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Tray | Skylake | - | 1151-LGA Module | 1151-LGA | Pentium G4400 | 3.3GHz | 2 Core，64-Bit | - | - | - | - | - | - | ||
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Advantech Corp |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
CELERON M 2.2G 2M 968P 2CORE
|
Tray | - | - | Module | - | Celeron M | 2.2GHz | 2 Core，64-Bit | - | DDR3，DDR3L | - | - | - | - |
