- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Voltage - I/O:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Display & Interface Controllers:
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- USB:
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- Selected conditions:
Discover 93 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | ||
NXP USA Inc. |
911
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
292
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
888
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
466
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | -20°C ~ 105°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
473
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
116
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP 1GHZ 624FCBGA
|
Tray | i.MX6DP | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,DDR3L,DDR3 | Yes | HDMI,Keypad,LCD,LVDS,MIPI/DSI,Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3),USB 2.0 OTG + PHY (1) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
156
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
142
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NO EPDC,2 ETH,NO CAN,2 OTG 1
|
Tray | i.MX7D | 0°C ~ 95°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7,ARM® Cortex®-M4 | 1.8V,3.3V | Multimedia; NEON® MPE | LPDDR2,LPDDR3,DDR3,DDR3L | No | Keypad,LCD,MIPI | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Cut Tape (CT) | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
- | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
283
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
EPDC,2 ETH,CAN,2 OTG 1 HSIC,
|
Tray | i.MX7D | 0°C ~ 95°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7,ARM® Cortex®-M4 | 1.8V,3.3V | Multimedia; NEON® MPE | LPDDR2,LPDDR3,DDR3,DDR3L | No | Keypad,LCD,MIPI | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
524
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
EPDC,2 ETH,CAN,2 OTG 1 HSIC,
|
Tray | i.MX7D | 0°C ~ 95°C (TJ) | 541-LFBGA | 541-MAPBGA (19x19) | ARM® Cortex®-A7,ARM® Cortex®-M4 | 1.8V,3.3V | Multimedia; NEON® MPE | LPDDR2,LPDDR3,DDR3,DDR3L | No | Keypad,LCD,MIPI | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
66
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
68
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP 1GHZ 624FCBGA
|
Tray | i.MX6DP | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,DDR3L,DDR3 | Yes | HDMI,Keypad,LCD,LVDS,MIPI/DSI,Parallel | 10/100/1000 Mbps (1) | SATA 3Gbps (1) | USB 2.0 + PHY (3),USB 2.0 OTG + PHY (1) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
NO EPDC,2 ETH,NO CAN,2 OTG 1
|
Tray | i.MX7D | -20°C ~ 105°C (TJ) | 488-TFBGA | 488-FBGA (12x12) | ARM® Cortex®-A7,ARM® Cortex®-M4 | 1.8V,3.3V | Multimedia; NEON® MPE | LPDDR2,LPDDR3,DDR3,DDR3L | No | Keypad,LCD,MIPI | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1),USB 2.0 OTG + PHY (2) | A-HAB,ARM TZ,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
49
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 0°C ~ 95°C (TJ) | 624-LFBGA | 624-MAPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | - | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
84
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
Tray | QorIQ Layerscape | 0°C ~ 105°C | 525-FBGA,FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | Multimedia; NEON® SIMD | DDR3L,DDR4 | - | - | GbE (3) | SATA 3Gbps (1) | USB 2.0 (1),USB 3.0 + PHY | Secure Boot,TrustZone® |