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Discover 68 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | ||
NXP USA Inc. |
770
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
395
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
888
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
788
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
514
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
165
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
169
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP 1GHZ 624FCBGA
|
Tray | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR3L,DDR3 | Yes | HDMI,Keypad,LCD,LVDS,MIPI/DSI,Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3),USB 2.0 OTG + PHY (1) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
473
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D 1.0GHZ 624FCBGA
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
116
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP 1GHZ 624FCBGA
|
Tray | i.MX6DP | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR3L,DDR3 | Yes | HDMI,Keypad,LCD,LVDS,MIPI/DSI,Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3),USB 2.0 OTG + PHY (1) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tape & Reel (TR) | i.MX6Q | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
500
|
3 days |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6Q 1.0GHZ 624FCBGA
|
Tape & Reel (TR) | i.MX6Q | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6D | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCPBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
66
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6D ENHANCED 624FCBGA
|
Tray | i.MX6D | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,LVDDR3,DDR3 | Yes | Keypad,LCD | 10/100/1000 Mbps (1) | USB 2.0 + PHY (4) | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC,Tamper Detection | ||||
NXP USA Inc. |
46
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP ENHAN 624FCBGA
|
Tray | i.MX6QP | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR3L,DDR3 | Yes | HDMI,Keypad,LCD,LVDS,MIPI/DSI,Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3),USB 2.0 OTG + PHY (1) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
68
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DP 1GHZ 624FCBGA
|
Tray | i.MX6DP | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 2 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR3L,DDR3 | Yes | HDMI,Keypad,LCD,LVDS,MIPI/DSI,Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3),USB 2.0 OTG + PHY (1) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
31
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP 1GHZ 624FCBGA
|
Tray | i.MX6QP | -20°C ~ 105°C (TJ) | 624-LFBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR3L,DDR3 | Yes | HDMI,Keypad,LCD,LVDS,MIPI/DSI,Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3),USB 2.0 OTG + PHY (1) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
87
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6QP 1GHZ 624FCBGA
|
Tray | i.MX6QP | -40°C ~ 125°C (TJ) | 624-FBGA,FCBGA | 624-FCBGA (21x21) | ARM® Cortex®-A9 | 1.8V,2.5V,2.8V,3.3V | 4 Core,32-Bit | Multimedia; NEON® SIMD | LPDDR2,DDR3L,DDR3 | Yes | HDMI,Keypad,LCD,LVDS,MIPI/DSI,Parallel | 10/100/1000 Mbps (1) | USB 2.0 + PHY (3),USB 2.0 OTG + PHY (1) | ARM TZ,A-HAB,CAAM,CSU,SJC,SNVS | ||||
NXP USA Inc. |
84
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
Tray | QorIQ Layerscape | 0°C ~ 105°C | 525-FBGA,FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | 2 Core,32-Bit | Multimedia; NEON® SIMD | DDR3L,DDR4 | - | - | GbE (3) | USB 2.0 (1),USB 3.0 + PHY | Secure Boot,TrustZone® | ||||
NXP USA Inc. |
84
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
Tray | QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA,FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | 2 Core,32-Bit | Multimedia; NEON® SIMD | DDR3L,DDR4 | - | - | GbE (3) | USB 2.0 (1),USB 3.0 + PHY | Secure Boot,TrustZone® | ||||
NXP USA Inc. |
78
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
LS1 32BIT ARM SOC 1GHZ DDR3/4
|
Tray | QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA,FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | - | 2 Core,32-Bit | Multimedia; NEON® SIMD | DDR3L,DDR4 | - | - | GbE (3) | USB 2.0 (1),USB 3.0 + PHY | Secure Boot,TrustZone® |