- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Co-Processors/DSP：
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- Ethernet：
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- USB：
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- Security Features：
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- Selected conditions:
Discover 59 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Co-Processors/DSP | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Co-Processors/DSP | Ethernet | USB | Security Features | |
|
|
|
NXP USA Inc. |
440
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
122
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
102
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM，Security; SEC | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
26
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
12
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
39
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM，Security; SEC | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
57
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
58
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
19
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM，Security; SEC | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM，Security; SEC | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM，Security; SEC | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM，Security; SEC | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | 10/100 Mbps (2) | USB 2.0 (1) | - |
