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- Supplier Device Package：
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- Voltage - I/O：
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- Co-Processors/DSP：
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- Ethernet：
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- Security Features：
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- Selected conditions:
Discover 49 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | |
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NXP USA Inc. |
28
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 300MHZ 352TBGA
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MPC82xx | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | - | SDRAM | - | - | - | ||
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NXP USA Inc. |
16
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 300MHZ 480TBGA
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MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
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|
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NXP USA Inc. |
40
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 516BGA
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MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
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NXP USA Inc. |
200
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 300MHZ 516BGA
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MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 40 MPQ: 1
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IC MPU MPC82XX 300MHZ 516BGA
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MPC82xx | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 24 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
MPC82xx | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | - | SDRAM | - | - | - | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 60 MPQ: 1
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IC MPU MPC6XX 300MHZ 255FCCBGA
|
MPC6xx | 255-BCBGA Exposed Pad | 255-FCCBGA (21x21) | PowerPC 603e | 3.3V | - | - | - | - | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC7XX 300MHZ 360FCBGA
|
MPC7xx | 360-BBGA，FCBGA | 360-FCPBGA (25x25) | PowerPC | 2.5V，3.3V | - | - | - | - | - |
