- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Voltage - I/O:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Selected conditions:
Discover 56 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | RAM Controllers | Ethernet | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | RAM Controllers | Ethernet | ||
NXP USA Inc. |
28
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | - | SDRAM | - | ||||
NXP USA Inc. |
16
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | - | SDRAM | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | - | SDRAM | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | - | SDRAM | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU MPC6XX 300MHZ 255FCCBGA
|
MPC6xx | 0°C ~ 105°C (TA) | 255-BCBGA Exposed Pad | 255-FCCBGA (21x21) | PowerPC 603e | 3.3V | - | - | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | Communications; RISC CPM | DRAM,SDRAM | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC7XX 300MHZ 360FCBGA
|
MPC7xx | 0°C ~ 105°C (TA) | 360-BBGA,FCBGA | 360-FCPBGA (25x25) | PowerPC | 2.5V,3.3V | - | - | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC7XX 300MHZ 360FCCBGA
|
MPC7xx | 0°C ~ 105°C (TA) | 360-BCBGA,FCCBGA | 360-CBGA (25x25) | PowerPC | 2.5V,3.3V | - | - | - |