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Discover 77 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | |
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Texas Instruments |
103
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU OMAP-L1X 300MHZ 176HLQFP
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Tray | OMAP-L1x | -55°C ~ 175°C (TJ) | 176-LQFP Exposed Pad | 176-HLQFP (24x24) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | Signal Processing; C674x，System Control; CP15 | SDRAM | No | LCD | 10/100 Mbps (1) | USB 1.1 + PHY (1)，USB 2.0 + PHY (1) | ||
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Texas Instruments |
601
|
3 days |
-
|
MOQ: 1 MPQ: 1
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SITARA PROCESSOR
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Tray | Sitara | -40°C ~ 105°C (TJ) | 324-LFBGA | 324-NFBGA(15x15) | ARM® Cortex®-A8 | 1.8V，3.3V | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR，DDR2，DDR3，DDR3L | No | - | - | USB 2.0 + PHY (2) | ||
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Texas Instruments |
1,347
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU SITARA 300MHZ 361NFBGA
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Tray | Sitara | -40°C ~ 90°C (TJ) | 361-LFBGA | 361-NFBGA (13x13) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | System Control; CP15 | LPDDR，DDR2 | No | LCD | 10/100 Mbps (1) | USB 2.0 + PHY (1) | ||
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Texas Instruments |
1,049
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU SITARA 300MHZ 361NFBGA
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Tray | Sitara | -40°C ~ 90°C (TJ) | 361-LFBGA | 361-NFBGA (16x16) | ARM926EJ-S | 1.8V，3.3V | 1 Core，32-Bit | System Control; CP15 | LPDDR，DDR2 | No | LCD | 10/100 Mbps (1) | USB 2.0 + PHY (1) | ||
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NXP USA Inc. |
28
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU MPC82XX 300MHZ 352TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 1 Core，32-Bit | - | SDRAM | No | - | - | - | ||
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NXP USA Inc. |
16
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 300MHZ 480TBGA
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Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | ||
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NXP USA Inc. |
200
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 300MHZ 516BGA
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Tray | MPC82xx | 0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (2) | USB 2.0 (1) | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 24 MPQ: 1
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IC MPU MPC82XX 300MHZ 352TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 1 Core，32-Bit | - | SDRAM | No | - | - | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 24 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 1 Core，32-Bit | - | SDRAM | No | - | - | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 24 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 3.3V | 1 Core，32-Bit | - | SDRAM | No | - | - | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 21 MPQ: 1
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IC MPU MPC82XX 300MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 3.3V | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | No | - | 10/100 Mbps (3) | - |
