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Discover 89 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Ethernet | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Ethernet | USB | Security Features | |
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NXP USA Inc. |
325
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC8XX 133MHZ 256BGA
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Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM，Security; SEC | DRAM | No | 10 Mbps (1)，10/100 Mbps (2) | USB 2.0 (1) | Cryptography | ||
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NXP USA Inc. |
1,080
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
Tray | MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM | DRAM | No | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
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NXP USA Inc. |
105
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
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Tray | MPC8xx | -40°C ~ 100°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM，Security; SEC | DRAM | No | 10 Mbps (3)，10/100 Mbps (2) | USB 2.0 (1) | Cryptography | ||
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NXP USA Inc. |
112
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM，Security; SEC | DRAM | No | 10 Mbps (3)，10/100 Mbps (2) | USB 2.0 (1) | Cryptography | ||
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NXP USA Inc. |
124
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM | DRAM | No | 10 Mbps (4)，10/100 Mbps (1) | - | - | ||
|
|
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NXP USA Inc. |
103
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM | DRAM | No | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
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Renesas Electronics America |
9
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 256LFBGA
|
Tray | - | -20°C ~ 75°C (TA) | 256-LFBGA | 256-LFBGA (11x11) | SH-3 DSP | 3.3V | 1 Core，32-Bit | - | - | - | - | - | - | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC8XX 133MHZ 357BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM | DRAM | No | 10 Mbps (4)，10/100 Mbps (1) | - | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 420 MPQ: 1
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IC MPU MPC83XX 133MHZ 369BGA
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Tray | MPC83XX | 0°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | No | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 420 MPQ: 1
|
IC MPU MPC83XX 133MHZ 369BGA
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Tray | MPC83XX | -40°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | No | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 84 MPQ: 1
|
IC MPU MPC83XX 133MHZ 369BGA
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Tray | MPC83XX | 0°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | No | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC MPU MPC83XX 133MHZ 369BGA
|
Tray | MPC83XX | -40°C ~ 105°C (TA) | 369-LFBGA | 369-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | No | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU MPC8XX 133MHZ 256BGA
|
Tray | MPC8xx | -40°C ~ 100°C (TA) | 256-BBGA | 256-PBGA (23x23) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM，Security; SEC | DRAM | No | 10 Mbps (1)，10/100 Mbps (2) | USB 2.0 (1) | Cryptography | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM | DRAM | No | 10 Mbps (2)，10/100 Mbps (2) | USB 2.0 (1) | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 44 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | MPC8xx | -40°C ~ 100°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM | DRAM | No | 10 Mbps (2)，10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM | DRAM | No | 10 Mbps (1)，10/100 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM | DRAM | No | 10 Mbps (1)，10/100 Mbps (1) | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC8XX 133MHZ 357BGA
|
Tray | MPC8xx | 0°C ~ 95°C (TA) | 357-BBGA | 357-PBGA (25x25) | MPC8xx | 3.3V | 1 Core，32-Bit | Communications; CPM | DRAM | No | 10 Mbps (4)，10/100 Mbps (1) | - | - | ||
|
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IDT，Integrated Device Technology Inc |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU MIPS32 133MHZ 144TQFP
|
Tray | - | 0°C ~ 70°C (TA) | 144-LQFP | 144-TQFP (20x20) | MIPS32 | 3.3V | 1 Core，32-Bit | System Control; CP0 | SDRAM | No | - | - | - | ||
|
|
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IDT，Integrated Device Technology Inc |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU MIPS32 133MHZ 144TQFP
|
Tray | - | 0°C ~ 70°C (TA) | 144-LQFP | 144-TQFP (20x20) | MIPS32 | 3.3V | 1 Core，32-Bit | System Control; CP0 | SDRAM | No | - | - | - |
