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Discover 10 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | USB | Security Features | |
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NXP USA Inc. |
10
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3 days |
-
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MOQ: 1 MPQ: 1
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I.MX 8MQUAD LT 17X17 NOL
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Tray | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 4 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | Yes | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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NXP USA Inc. |
55
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3 days |
-
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MOQ: 1 MPQ: 1
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I.MX 8MQUAD 17X17 NO LID
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Tray | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 4 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | Yes | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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I.MX 8MDUAL 17X17 NO LID
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Tray | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 2 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | Yes | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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Renesas Electronics America |
Inquiry
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-
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MOQ: 25 MPQ: 1
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SOC RZ/G1N DUAL CORE A15 SGX544M
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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I.MX 8MDUAL 17X17 NO LID 621FBGA
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Tray | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 2 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | Yes | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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I.MX 8MQUAD 17X17 NO LID 621FBGA
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Tray | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 4 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | Yes | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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Renesas Electronics America |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 831FBGA
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- | -40°C ~ 85°C (TA) | - | - | ARM® Cortex®-A15 | - | - | - | - | - | - | - | - | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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I.MX 8MQUAD 17X17 NO LID 621FBGA
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Tray | -40°C ~ 105°C (TJ) | 621-FBGA，FCBGA | 621-FCPBGA (17x17) | ARM® Cortex®-A53 | 4 Core，32-Bit | ARM® Cortex®-M4 | DDR3L，DDR4，LPDDR4 | Yes | eDP，HDMI，MIPI-CSI，MIPI-DSI | GbE | USB 3.0 (2) | ARM TZ，CAAM，HAB，RDC，RTC，SJC，SNVS | ||
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Renesas Electronics America |
Inquiry
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- |
-
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MOQ: 25 MPQ: 1
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SOC RZ/G1M DUAL CORE A15 SGX544M
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Renesas Electronics America |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT ROMLESS 831FBGA
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- | -40°C ~ 85°C (TA) | - | - | ARM® Cortex®-A15 | - | - | - | - | - | - | - | - |
