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Discover 21 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | RAM Controllers | Ethernet | USB | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Co-Processors/DSP | RAM Controllers | Ethernet | USB | |
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NXP USA Inc. |
305
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC82XX 450MHZ 480TBGA
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MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
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NXP USA Inc. |
368
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
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NXP USA Inc. |
98
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
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NXP USA Inc. |
19
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
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NXP USA Inc. |
15
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
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|
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NXP USA Inc. |
3
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
|
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NXP USA Inc. |
5
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
|
|
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NXP USA Inc. |
21
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 44 MPQ: 1
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IC MPU MPC74XX 450MHZ 360FCCLGA
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MPC74xx | 0°C ~ 105°C (TA) | 360-CLGA，FCCLGA | 360-FCCLGA (25x25) | PowerPC G4 | 1.8V，2.5V，3.3V | - | - | - | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 44 MPQ: 1
|
IC MPU MPC74XX 450MHZ 360FCCLGA
|
MPC74xx | 0°C ~ 105°C (TA) | 360-CLGA，FCCLGA | 360-FCCLGA (25x25) | PowerPC G4 | 1.8V，2.5V，3.3V | - | - | - | - | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | USB 2.0 (1) | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC74XX 450MHZ 360FCCBGA
|
MPC74xx | 0°C ~ 105°C (TA) | 360-BCBGA，FCCBGA | 360-CBGA (25x25) | PowerPC G4 | 1.8V，2.5V，3.3V | - | - | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC74XX 450MHZ 360FCCBGA
|
MPC74xx | 0°C ~ 105°C (TA) | 360-BCBGA，FCCBGA | 360-CBGA (25x25) | PowerPC G4 | 1.8V，2.5V，3.3V | - | - | - | - |
