- Manufacturer:
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- Series:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Display & Interface Controllers:
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- Ethernet:
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Discover 22 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | ||
NXP USA Inc. |
305
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
368
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
98
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
19
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
15
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
3
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
5
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
21
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
STMicroelectronics |
Inquiry
|
- |
-
|
MOQ: 504 MPQ: 1
|
LFBGA16X16X1.7 361 F
|
- | -40°C ~ 85°C (TA) | 361-LFBGA | 361-LFBGA (16x16) | ARM® Cortex®-R4 | ARM® Cortex®-M3 | SDRAM | Yes | LCD,Touchscreen | - | ||||
STMicroelectronics |
Inquiry
|
- |
-
|
MOQ: 1300 MPQ: 1
|
LFBGA16X16X1.7 361 F
|
- | -40°C ~ 85°C (TA) | 361-LFBGA | 361-LFBGA (16x16) | ARM® Cortex®-R4 | ARM® Cortex®-M3 | SDRAM | Yes | LCD,Touchscreen | - | ||||
STMicroelectronics |
Inquiry
|
- |
-
|
MOQ: 504 MPQ: 1
|
LFBGA16X16X1.7 361 F
|
- | -40°C ~ 85°C (TA) | 361-LFBGA | 361-LFBGA (16x16) | ARM® Cortex®-R4 | ARM® Cortex®-M3 | SDRAM | Yes | LCD,Touchscreen | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 2 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | Communications; RISC CPM | DRAM,SDRAM | No | - | 10/100 Mbps (3) | ||||
STMicroelectronics |
Inquiry
|
- |
-
|
MOQ: 1056 MPQ: 1
|
TFBGA11SQX1.2 256 F1
|
- | -40°C ~ 85°C (TA) | 256-TFBGA | 256-TFBGA (11x11) | ARM® Cortex®-R4 | ARM® Cortex®-M3 | SDRAM | No | LCD,Touchscreen | - |