- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Voltage - I/O:
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- Co-Processors/DSP:
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- RAM Controllers:
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- SATA:
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- Security Features:
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- Selected conditions:
Discover 67 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | ||
NXP USA Inc. |
189
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V,3.3V | 800MHz | Security; SEC 3.3 | DDR2,DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
192
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.067GHZ 689TBGA
|
Tray | -40°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1.067GHz | - | DDR2,DDR3 | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | ||||
NXP USA Inc. |
54
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V,3.3V | 800MHz | - | DDR2,DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | ||||
NXP USA Inc. |
170
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | Communications; QUICC Engine,Security; SEC 3.3 | DDR2,DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
150
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V,3.3V | 800MHz | Security; SEC 3.3 | DDR2,DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
32
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
Tray | 0°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1.055GHz | - | DDR2,DDR3 | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | - | ||||
NXP USA Inc. |
27
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | Communications; QUICC Engine,Security; SEC 3.3 | DDR2,DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
26
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
Tray | -40°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1.055GHz | Security; SEC | DDR2,DDR3 | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
58
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V,3.3V | 800MHz | Security; SEC 3.3 | DDR2,DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
18
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V,3.3V | 800MHz | - | DDR2,DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | ||||
NXP USA Inc. |
61
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 1.055GHZ 689TBGA
|
Tray | 0°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1.055GHz | Security; SEC | DDR2,DDR3 | LCD | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
54
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | Communications; QUICC Engine,Security; SEC 3.3 | DDR2,DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | Communications; QUICC Engine,Security; SEC 3.3 | DDR2,DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 800MHz | Communications; QUICC Engine | DDR2,DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | - | DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V,3.3V | 800MHz | - | DDR2,DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | Security; SEC 3.3 | DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | -40°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | - | DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | Communications; QUICC Engine,Security; SEC 3.3 | DDR2,DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography,Random Number Generator | ||||
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | -40°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | - | 667MHz | Security; SEC 3.3 | DDR3 | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | Cryptography,Random Number Generator |