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Discover 8 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | SATA | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | SATA | USB | Security Features | |
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NXP USA Inc. |
84
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3 days |
-
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MOQ: 1 MPQ: 1
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LS1 32BIT ARM SOC 600MHZ DDR3L
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QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 600MHz | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1) | Secure Boot，TrustZone® | ||
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NXP USA Inc. |
Inquiry
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-
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MOQ: 84 MPQ: 1
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LS1 32BIT ARM SOC 600MHZ DDR3L
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QorIQ Layerscape | 0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 600MHz | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1) | Secure Boot，TrustZone® | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 84 MPQ: 1
|
LS1 32BIT ARM SOC 600MHZ DDR3L
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QorIQ Layerscape | 0°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 600MHz | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1) | Secure Boot，TrustZone® | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 84 MPQ: 1
|
LS1 32BIT ARM SOC 600MHZ DDR3L
|
QorIQ Layerscape | -40°C ~ 105°C | 525-FBGA，FCBGA | 525-FCPBGA (19x19) | ARM® Cortex®-A7 | 600MHz | Multimedia; NEON® SIMD | DDR3L，DDR4 | - | SATA 3Gbps (1) | USB 2.0 (1) | Secure Boot，TrustZone® | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 60 MPQ: 1
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IC PROCESSOR DUAL CORE
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QorlQ LS1 | 0°C ~ 70°C (TA) | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | ARM1136JF-S | 650MHz | - | DDR2 | No | - | USB 2.0 + PHY (1) | - | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 60 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
QorlQ LS1 | 0°C ~ 70°C (TA) | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | ARM1136JF-S | 650MHz | - | DDR2 | No | - | USB 2.0 + PHY (1) | - | |||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 84 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
QorlQ LS1 | 0°C ~ 70°C (TA) | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | ARM1136JF-S | 650MHz | - | DDR2 | No | - | USB 2.0 + PHY (1) | - | |||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 84 MPQ: 1
|
IC PROCESSOR DUAL CORE
|
QorlQ LS1 | 0°C ~ 70°C (TA) | 448-FBGA Exposed Pad | 448-PBGA w/Heat Spreader (23x23) | ARM1136JF-S | 650MHz | - | DDR2 | No | - | USB 2.0 + PHY (1) | - |
