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Discover 63 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | Graphics Acceleration | Display & Interface Controllers | USB | Security Features | |
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Microchip Technology |
1,000
|
3 days |
-
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MOQ: 500 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324LFBGA
|
Tape & Reel (TR) | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | - | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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Microchip Technology |
1,889
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324LFBGA
|
Cut Tape (CT) | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | - | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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|
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Microchip Technology |
1,889
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324LFBGA
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- | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | - | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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|
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Microchip Technology |
3,968
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324LFBGA
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Tray | SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | - | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
|
|
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Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324TFBGA
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Tape & Reel (TR) | SAMA5D3 | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (12x12) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | - | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
|
|
|
Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324TFBGA
|
Cut Tape (CT) | SAMA5D3 | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (12x12) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | - | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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|
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Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324TFBGA
|
- | SAMA5D3 | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (12x12) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | - | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
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NXP USA Inc. |
450
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX50 800MHZ 400MAPBGA
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Tray | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | Yes | LCD | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
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NXP USA Inc. |
450
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
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Tray | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | Yes | LCD | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
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Microchip Technology |
53
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324TFBGA
|
Tray | SAMA5D3 | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (12x12) | ARM® Cortex®-A5 | 1.2V，1.8V，3.3V | 536MHz | - | No | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | ||
|
|
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NXP USA Inc. |
450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
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Tray | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | Yes | LCD | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MPU I.MX50 800MHZ 416MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | Yes | LCD | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX50 800MHZ 416MAPBGA
|
Tape & Reel (TR) | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | Yes | LCD | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX50 800MHZ 416MAPBGA
|
Tape & Reel (TR) | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | Yes | EPDC，LCD | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tape & Reel (TR) | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | Yes | EPDC，LCD | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tape & Reel (TR) | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | Yes | LCD | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | -20°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | Yes | LCD | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 800 MPQ: 1
|
IC MPU I.MX50 800MHZ 416MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | Yes | EPDC，LCD | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC MPU I.MX50 800MHZ 416MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 416-LFBGA | 416-MAPBGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | Yes | LCD | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MPU I.MX50 800MHZ 400MAPBGA
|
Tray | i.MX50 | 0°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | Yes | EPDC，LCD | USB 2.0 + PHY (2) | Boot Security，Cryptography，Secure JTAG |
