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Discover 3,775 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | Ethernet | SATA | USB | Security Features | |
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NXP USA Inc. |
1,366
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX23 454MHZ 128LQFP
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Tray | i.MX23 | -10°C ~ 70°C (TA) | 128-LQFP | 128-LQFP (14x14) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 454MHz | 1 Core，32-Bit | Data; DCP | DRAM | LCD，Touchscreen | - | - | USB 2.0 + PHY (1) | Cryptography，Hardware ID | ||
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NXP USA Inc. |
820
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX6UL 289BGA
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Tray | i.MX6UL | -40°C ~ 105°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.2V，1.35V，1.5V，1.8V，2.5V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® SIMD | LPDDR2，DDR3，DDR3L | LCD，LVDS | 10/100 Mbps (2) | - | USB 2.0 + PHY (2) | ARM TZ，A-HAB，CAAM，CSU，SJC，SNVS | ||
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NXP USA Inc. |
538
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX28 454MHZ 289MAPBGA
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Tray | i.MX28 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-MAPBGA (14x14) | ARM926EJ-S | 1.8V，3.3V | 454MHz | 1 Core，32-Bit | Data; DCP | LVDDR，LVDDR2，DDR2 | Keypad，LCD，Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Hardware ID | ||
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NXP USA Inc. |
5,402
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU I.MX25 400MHZ 400MAPBGA
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Tray | i.MX25 | -20°C ~ 70°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | Keypad | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | - | ||
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NXP USA Inc. |
1,764
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU I.MX25 400MHZ 400MAPBGA
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Tray | i.MX25 | -40°C ~ 85°C (TA) | 400-LFBGA | 400-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V，3.3V | 400MHz | 1 Core，32-Bit | - | LPDDR，DDR，DDR2 | Keypad，LCD，Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | - | ||
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NXP USA Inc. |
8,725
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU I.MX28 454MHZ 289MAPBGA
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Tray | i.MX28 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-MAPBGA (14x14) | ARM926EJ-S | 1.8V，3.3V | 454MHz | 1 Core，32-Bit | Data; DCP | LVDDR，LVDDR2，DDR2 | Keypad，LCD，Touchscreen | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | Boot Security，Cryptography，Hardware ID | ||
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NXP USA Inc. |
2,652
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC83XX 400MHZ 473MAPBGA
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Tray | MPC83XX | 0°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 400MHz | 1 Core，32-Bit | - | DDR2 | - | 10/100/1000 Mbps (3) | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
453
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC83XX 417MHZ 489BGA
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Tray | MPC83XX | -40°C ~ 105°C (TA) | 489-LFBGA | 489-PBGA (19x19) | PowerPC e300c3 | 1.8V，3.3V | 417MHz | 1 Core，32-Bit | Communications; QUICC Engine | DDR2 | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
596
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC83XX 333MHZ 516BGA
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Tray | MPC83XX | 0°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 333MHz | 1 Core，32-Bit | - | DDR，DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | - | ||
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NXP USA Inc. |
133
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU MPC83XX 333MHZ 516BGA
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Tray | MPC83XX | -40°C ~ 105°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | PowerPC e300c3 | 1.8V，2.5V，3.3V | 333MHz | 1 Core，32-Bit | Security; SEC 2.2 | DDR，DDR2 | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | Cryptography | ||
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NXP USA Inc. |
415
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MPU MPC52XX 400MHZ 272BGA
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Tray | MPC52xx | 0°C ~ 70°C (TA) | 272-BBGA | 272-PBGA (27x27) | PowerPC e300 | 2.5V，3.3V | 400MHz | 1 Core，32-Bit | - | DDR，SDRAM | - | 10/100 Mbps (1) | - | USB 1.1 (2) | - | ||
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NXP USA Inc. |
471
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU M683XX 20MHZ 100LQFP
|
Tray | M683xx | 0°C ~ 70°C (TA) | 100-LQFP | 100-LQFP (14x14) | M68000 | 5.0V | 20MHz | 1 Core，8/16-Bit | Communications; RISC CPM | DRAM | - | - | - | - | - | ||
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NXP USA Inc. |
495
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MPU MPC52XX 400MHZ 272BGA
|
Tray | MPC52xx | -40°C ~ 85°C (TA) | 272-BBGA | 272-PBGA (27x27) | PowerPC e300 | 2.5V，3.3V | 400MHz | 1 Core，32-Bit | - | DDR，SDRAM | - | 10/100 Mbps (1) | - | USB 1.1 (2) | - | ||
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NXP USA Inc. |
190
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MPU M683XX 16MHZ 132QFP
|
Tray | M683xx | 0°C ~ 70°C (TA) | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) | M68000 | 5.0V | 16MHz | 1 Core，8/16-Bit | Communications; RISC CPM | DRAM | - | - | - | - | - | ||
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|
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NXP USA Inc. |
734
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 400MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | - | 10/100 Mbps (2) | - | USB 2.0 (1) | - | ||
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|
|
NXP USA Inc. |
440
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 3.3V | 266MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
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NXP USA Inc. |
72
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU M683XX 25MHZ 240FQFP
|
Tray | M683xx | 0°C ~ 70°C (TA) | 240-BFQFP | 240-FQFP (32x32) | CPU32+ | 5.0V | 25MHz | 1 Core，32-Bit | Communications; CPM | DRAM | - | 10 Mbps (1) | - | - | - | ||
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|
|
NXP USA Inc. |
305
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | 0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
368
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
98
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
Tray | MPC82xx | -40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 3.3V | 450MHz | 1 Core，32-Bit | Communications; RISC CPM | DRAM，SDRAM | - | 10/100 Mbps (3) | - | USB 2.0 (1) | - |
