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Discover 75 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | SATA | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | SATA | USB | Security Features | |
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|
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NXP USA Inc. |
990
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX27 400MHZ 404MAPBGA
|
Tray | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Yes | - | USB 2.0 + PHY (3) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
1,680
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 1.0GHZ 529TEBGA-2
|
Tray | i.MX53 | -20°C ~ 85°C (TC) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
870
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX27 400MHZ 473MAPBGA
|
Tray | i.MX27 | -40°C ~ 85°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Yes | - | USB 2.0 + PHY (3) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
313
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
773
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
1,917
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA
|
Tray | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
442
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA-2
|
Tray | i.MX53 | -40°C ~ 85°C (TA) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
1,385
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
1,353
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-LFBGA | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | - | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
|
NXP USA Inc. |
450
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX27 400MHZ 404MAPBGA
|
Tray | i.MX27 | -20°C ~ 85°C (TA) | 404-LFBGA | 404-MAPBGA (17x17) | ARM926EJ-S | 2.0V，2.5V，2.7V，3.0V | 400MHz | Security; SAHARAH2 | DDR | Yes | - | USB 2.0 + PHY (3) | Cryptography，Random Number Generator，RTIC，Secure Fusebox，Secure Memory | ||
|
|
|
NXP USA Inc. |
161
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 529-LFBGA | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | LPDDR，DDR2 | No | - | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
|
NXP USA Inc. |
147
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX53 800MHZ 529TEBGA-2
|
Tray | i.MX53 | -40°C ~ 125°C (TJ) | 529-FBGA | 529-FBGA (19x19) | ARM® Cortex®-A8 | 1.3V，1.8V，2.775V，3.3V | 800MHz | Multimedia; NEON® SIMD | LPDDR2，DDR2，DDR3 | Yes | SATA 1.5Gbps (1) | USB 2.0 (2)，USB 2.0 + PHY (2) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
150
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
159
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
800
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 800MHZ 529BGA
|
Tray | i.MX51 | -20°C ~ 85°C (TC) | 527-LFBGA | 527-BGA (13x13) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 800MHz | Multimedia; NEON® SIMD | LPDDR，DDR2 | Yes | - | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
|
NXP USA Inc. |
420
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tray | i.MX51 | -40°C ~ 95°C (TC) | 529-LFBGA | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 600MHz | Multimedia; NEON® SIMD | LPDDR，DDR2 | No | - | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
|
NXP USA Inc. |
39
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX51 600MHZ 529BGA
|
Tray | i.MX51 | -40°C ~ 95°C (TC) | 529-LFBGA | 529-BGA (19x19) | ARM® Cortex®-A8 | 1.2V，1.875V，2.775V，3.0V | 600MHz | Multimedia; NEON® SIMD | LPDDR，DDR2 | No | - | USB 2.0 (3)，USB 2.0 + PHY (1) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
|
|
|
NXP USA Inc. |
92
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
I.MX 6SL ROM PERF ENHAN
|
Tray | i.MX6SL | 0°C ~ 95°C (TJ) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6SL 1.0GHZ 432MAPBGA
|
Tray | i.MX6SL | -40°C ~ 105°C (TA) | 432-TFBGA | 432-MAPBGA (13x13) | ARM® Cortex®-A9 | 1.2V，1.8V，3.0V | 1.0GHz | Multimedia; NEON® SIMD | LPDDR2，LVDDR3，DDR3 | Yes | - | USB 2.0 + PHY (3) | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC，Tamper Detection |
